Assembly with a carrier substrate and at least one electrical component arranged thereon, and electrical component
An electronic assembly has a carrier substrate with contact surfaces and at least one electrical component on the carrier substrate. On its surface that is oriented toward the carrier substrate, the component has a number of contacting solder balls, which are respectively connected to a contact surface assigned to them. On the surface of the electrical component that is oriented toward the carrier substrate there is also arranged at least one fixing solder ball, which has a greater diameter than the contacting solder balls. The carrier substrate has at the location at which the at least one fixing solder ball is in contact with the carrier substrate a depression, in which the fixing solder ball is placed.
1. An assembly, comprising: a carrier substrate formed with contact surfaces; at least one electrical component arranged on said carrier substrate, said at least one electrical component having a planar facing surface oriented toward said carrier substrate and formed with other contact surfaces; a plurality of contacting solder balls directly attached to respective said other contact surfaces disposed on said facing surface and directly connected to respective said contact surfaces on said substrate assigned thereto at least one fixing solder ball arranged on said facing surface of said electrical component that is oriented toward said carrier substrate, said at least one fixing solder ball having a greater diameter than said contacting solder balls and being disposed to fix a relative position between said carrier substrate and said electrical component and to prevent displacement of said electrical component relative to said carrier substrate prior to soldering; and said carrier substrate, at a location at which said at least one fixing solider ball is in contact with said carrier substrate, being formed with a depression formed to receive said at least one fixing solder ball.
2. The assembly according to claim 1 , wherein said at least one fixing solder ball is one of at least two fixing solder balls having a greater diameter than said contacting solder balls and being arranged at least at two locations in the peripheral region of said electrical component, and said carrier substrate is formed with depressions in which said fixing solder balls are placed at the locations at which said fixing solder balls are in contact with said carrier substrate.
3. The assembly according to claim 2 , wherein said depressions are through-holes extending through said carrier substrate.
4. The assembly according to claim 3 , wherein a wall of at least of one of said through-holes is metallized.
5. The assembly according to claim 1 , wherein said depression is a through-hole extending through said carrier substrate.
6. The assembly according to claim 5 , wherein a wall of said through-hole is metallized.