Low-profile spring-loaded contacts
Contact structures that are readily manufactured, where contacts in the contact structures provide a sufficient normal force while consuming a minimal amount of surface area, depth, and volume in an electronic device.
1. A contact structure comprising:
a housing;
a first contact and a second contact, each comprising:
a flexible lever arm;
a contacting portion attached to a first end of the flexible lever arm, the contacting portion having a wider body portion and a narrowed tail, the narrowed tail located in an opening in the first end of the flexible lever arm; and
a barb on a second end of the flexible lever arm, the barb inserted into the housing; and
a cover attached to a top of the housing, the cover having a plurality of openings each for a contacting portion of the first and second contacts.
2. The contact structure of claim 1 wherein the contacting portion of each contact is riveted to the first end of the flexible lever arm.
3. The contact structure of claim 1 wherein the cover comprises a raised portion around a plurality of openings.
4. The contact structure of claim 1 wherein the housing comprises a bottom opening to accept an insertion of a central contact and side slots to accept the insertion of the first and second contacts during assembly.
5. The contact structure of claim 1 further comprising a third contact comprising:
a flexible lever arm;
a contacting portion attached to a first end of the flexible lever arm; and
a second end of the flexible lever arm,
wherein the housing is insert molded around a portion of the third contact.
6. The contact structure of claim 5 further comprising a surface-mount contact portion near the second end of the flexible lever arm of each of the first, second, and third contacts.
7. A contact structure comprising:
a circuit board;
a plurality of spring-biased contacts mounted on a top side of the circuit board;
a cap over the spring-biased contacts and having a plurality of openings, each for a contacting portion of one of the plurality of spring-biased contacts;
a bracket fixed to a bottom side of the circuit board; and
a lid over the cap and fixed to bracket,
wherein the cap includes a raised portion, the plurality of openings on the raised portion, where the raised portion fits in a first opening in the lid.
8. The contact structure of claim 7 wherein each of the spring-biased contacts comprises:
a housing having a central hole surrounded by a plurality of slots in a top surface;
a spring having a first end in the central hole;
a contacting portion having a back side cavity, a second end of the spring in the back side cavity; and
a terminal structure having a number of tabs fit into the plurality of slots in the top surface of the housing and a central passage around the contacting portion.
9. The contact structure of claim 8 wherein the contacting portion includes a first contacting portion tab, the first contacting portion tab under the terminal structure.
10. The contact structure of claim 9 wherein the terminal structure includes two raised portions, wherein the two raised portions fit in the back side cavity of the contacting portion.
11. The contact structure of claim 10 wherein the terminal structure comprises two tabs extending downward that fit in corresponding slots in the housing.
12. The contact structure of claim 7 wherein the circuit board is a flexible circuit board.
13. The contact structure of claim 12 wherein the spring-biased contacts are mounted on the circuit board by inserting terminals of the plurality of spring-biased contacts into openings in the circuit board.
14. The contact structure of claim 12 further comprising a gasket around the raised portion of the cap and between the cap and the lid.
15. The contact structure of claim 14 wherein the lid is fixed to the bracket using threaded inserts that are press-fit into side openings in the bracket and screws that are inserted into side openings in the lid and screwed into the threaded inserts in the bracket.
16. The contact structure of claim 15 wherein the cap is fixed to the circuit board using a first adhesive layer.
17. The contact structure of claim 16 wherein the circuit board is fixed to the bracket using a second adhesive layer.
18. The contact structure of claim 17 wherein the first adhesive layer and the second adhesive layer are heat-activated layers.