Preform member bonding method
Provided is a preform member bonding method of bonding a preform member and another member with an adhesive in an RTM process. The preform member bonding method includes increasing viscosity of the adhesive by heat-treating only the adhesive in advance before inserting the adhesive between bonding surfaces of the preform member and the other member.
1. A preform member bonding method of bonding a preform member and another member with an adhesive in resin transfer molding, comprising
a staging step of beforehand heat-treating only the adhesive to reach a ST temperature so as to progress hardening of the adhesive before inserting the adhesive between bonding surfaces of the preform member and the other member,
a temperature lowering step of lowering a temperature of the adhesive to a temperature lower than the ST temperature, and
a pre-heating step of heat-treating the preform member together with the adhesive to reach and hold at a pre-heat temperature lower than the ST temperature after inserting the adhesive between bonding surfaces of the preform member and the other member, wherein
the temperature of the adhesive lowered in the temperature lowering step is lower than the pre-heat temperature.
2. A preform member bonding method comprising:
a staging step of beforehand heat-treating an adhesive, which is placed in a bond area of a hardened member, to reach a ST temperature so as to progress hardening of the adhesive;
a temperature lowering step of lowering a temperature of the adhesive to a temperature lower than the ST temperature, and
a pre-heating step of heat-treating the preform member together with the adhesive to reach and hold at a pre-heat temperature lower than the ST temperature after placing a preform member on the heat-treated adhesive, wherein
the temperature of the adhesive lowered in the temperature lowering step is lower than the pre-heat temperature.
3. A composite material producing method comprising:
a staging step of beforehand heat-treating an adhesive, which is placed in a bond area of a hardened member, to reach a ST temperature so as to progress hardening of the adhesive;
a temperature lowering step of lowering a temperature of the adhesive to a temperature lower than the ST temperature, and
a pre-heating step of heat-treating the preform member together with the adhesive to reach and hold at a pre-heat temperature lower than the ST temperature before or during resin impregnation after placing a preform member on the heat-treated adhesive, wherein
the temperature of the adhesive lowered in the temperature lowering step is lower than the pre-heat temperature.