IP Library Granted Patent US 9,559,197
Granted Patent B2
US 9,559,197 · App. 15/138,808 · Granted Jan 31, 2017

Hetero-junction semiconductor device and method of manufacturing a hetero-junction semiconductor device

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Quick Facts
Patent No.
US 9,559,197
App. No.
15/138,808
Granted
Jan 31, 2017
Kind
B2
Abstract

A hetero-junction semiconductor device includes: a channel layer that includes a first semiconductor; a barrier layer that is provided on the channel layer and includes a semiconductor having a band gap larger than a band gap of the first semiconductor; a source electrode and a drain electrode that are provided on the barrier layer and are ohmic contacted to the barrier layer; a p-type semiconductor layer provided on the barrier layer, the p-type semiconductor layer being provided in a region between the source electrode and the drain electrode on the barrier layer; an n-type semiconductor layer that is provided on the p-type semiconductor layer; and a gate electrode that is joined to the n-type semiconductor layer. A joint interface between the p-type semiconductor layer and the n-type semiconductor layer has a concavo-convex structure.

Claims (21)

1. A hetero-junction semiconductor device comprising:

a channel layer that includes a first semiconductor;

a barrier layer that is provided on the channel layer and includes a semiconductor having a band gap larger than a band gap of the first semiconductor;

a source electrode and a drain electrode that are provided on the barrier layer and are ohmic contacted to the barrier layer;

a p-type semiconductor layer provided on the barrier layer, the p-type semiconductor layer being provided in a region between the source electrode and the drain electrode on the barrier layer;

an n-type semiconductor layer that is provided on the p-type semiconductor layer; and

a gate electrode that is joined to the n-type semiconductor layer, wherein

a joint interface between the p-type semiconductor layer and the n-type semiconductor layer has a concavo-convex structure.

2. The hetero-junction semiconductor device according to claim 1 , wherein

in a convex region of the p-type semiconductor layer of the concavo-convex structure, the p-type semiconductor layer and the gate electrode are joined to each other through an insulating layer.

3. The hetero-junction semiconductor device according to claim 1 , wherein

the gate electrode is provided on a top surface of the n-type semiconductor layer and a side surface of the n-type semiconductor layer.

4. The hetero-junction semiconductor device according to claim 1 , wherein

a corner of the concavo-convex structure has a curved surface.

5. The hetero-junction semiconductor device according to claim 1 , wherein

the channel layer is composed of GaN,

the barrier layer is composed of AlGaN,

the p-type semiconductor layer is composed of p-type GaN, and

the n-type semiconductor layer is composed of n-type GaN.

6. The hetero-junction semiconductor device according to claim 1 , wherein

a width of a groove in the concavo-convex structure is set such that a depletion layer spreads over an entire convex region of the p-type semiconductor layer and an entire convex region of the n-type semiconductor layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: TOYOTA JIDOSHA KABUSHIKI KAISHA
To: DENSO CORPORATION
Reel/Frame 052285/0419 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2016
From: OKAWA, TAKASHI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 038523/0761 →