Refrigerator Appliance and Heater for Preventing Condensation
An appliance is provided that may include a cabinet, a board enclosure, an electronic circuit board, and a heating conduit. The cabinet may have an outer surface and an inner surface defining an enclosed chilled chamber. The board enclosure may define a protective cavity and be attached to the outer surface of the cabinet. The electronic circuit board may be attached to the board enclosure within the protective cavity. The heating conduit may enclose a circulating fluid. The heating conduit may be positioned in conductive heating engagement with a portion of the board enclosure to supply heat to the protective cavity.
1 . An appliance comprising:
a cabinet having an outer surface and an inner surface defining an enclosed chilled chamber;
a board enclosure defining a protective cavity, the board enclosure being attached to the outer surface of the cabinet;
an electronic circuit board attached to the board enclosure within the protective cavity; and
a heating conduit enclosing a circulating fluid, the heating conduit being positioned in conductive heating engagement with a portion of the board enclosure to supply heat to the protective cavity.
2 . The appliance of claim 1 , wherein the heating conduit is attached to the board enclosure between the chilled chamber and the electronic circuit board.
3 . The appliance of claim 2 , further comprising a foam insulation positioned on the heating conduit between the outer surface and the board enclosure.
4 . The appliance of claim 1 , wherein the circulating fluid includes a refrigerant.
5 . The appliance of claim 4 , further comprising a compressor disposed in fluid communication with the heating conduit and upstream therefrom, the compressor being operable to flow the refrigerant through the heating conduit.
6 . The appliance of claim 5 , further comprising a condenser disposed in fluid communication with the heating conduit and upstream therefrom, wherein the condenser receives the flow of refrigerant from the compressor before the refrigerant enters the heating conduit.
7 . The appliance of claim 6 , further comprising a fluid filter disposed in fluid communication with the heating conduit and downstream therefrom, the fluid filter being operable to draw excessive moisture from the refrigerant.
8 . The appliance of claim 1 , wherein the heating conduit defines a plurality of conduit passes positioned on the board enclosure.
9 . The appliance of claim 1 , wherein the board enclosure includes a plurality of integral tabs extending from the board enclosure in contact with the heating conduit.
10 . The appliance of claim 1 , further comprising:
a retention plate positioned across the heating conduit between the outer surface and the heating conduit.
11 . The appliance of claim 10 , wherein the retention plate defines a plurality of apertures extending through the retention plate.
12 . The appliance of claim 11 , wherein the heating conduit is attached to the board enclosure between the chilled chamber and the electronic circuit board.
13 . The appliance of claim 12 , further comprising a foam insulation extending through the apertures of the retention plate between the outer surface and the board enclosure.
14 . An appliance comprising:
a cabinet having an outer surface and an inner surface defining an enclosed chilled chamber;
a board enclosure defining a protective cavity, the board enclosure being attached to the outer surface of the cabinet;
an electronic circuit board attached to the board enclosure within the protective cavity; and
a sealed refrigeration loop comprising
a compressor operable to generate a flow of refrigerant,
a condenser disposed downstream of the compressor such that the condenser receives the flow of refrigerant from the compressor during operation of the compressor,
a heating conduit disposed downstream of the condenser in conductive heating engagement with a portion of the board enclosure to supply heat to the protective cavity, and
an expansion device disposed downstream of the heating conduit.
15 . The appliance of claim 14 , wherein the heating conduit is attached to the board enclosure between the chilled chamber and the electronic circuit board.
16 . The appliance of claim 14 , wherein the heating conduit defines a plurality of conduit passes positioned on the board enclosure.
17 . The appliance of claim 1 , further comprising:
a retention plate positioned across the heating conduit between the outer surface and the heating conduit.
18 . The appliance of claim 10 , wherein the retention plate defines a plurality of apertures extending through the retention plate.
19 . The appliance of claim 11 , wherein the heating conduit is attached to the board enclosure between the chilled chamber and the electronic circuit board.
20 . The appliance of claim 12 , further comprising a foam insulation extending through the apertures of the retention plate between the outer surface and the board enclosure.