Electronic apparatus and method for fabricating the same
An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
1. An electronic apparatus comprising:
a first electronic part with a first terminal;
a second electronic part with a second terminal opposite the first terminal; and
a joining portion including a first compound and a second compound, the first compound including an intermetallic compound containing a first element and a second element different from the first element, the first compound extending in a direction from the first terminal to the second terminal, the second compound containing the first element and the second element, the second compound joining the first terminal and the second terminal, the second compound being around the first compound; wherein
the first element is Sn, the second element is Ag, and the intermetallic compound is Ag 3 Sn.
2. The electronic apparatus according to claim 1 further comprising a first member which is disposed over the first electronic part and which has first heat capacity.
3. The electronic apparatus according to claim 2 , wherein the first member is separate from the second electronic part.
4. The electronic apparatus according to claim 2 , wherein heat capacity of the first electronic part over which the first member is disposed is larger than heat capacity of the second electronic part.