IP Library Granted Patent US 9,606,743
Granted Patent B2
US 9,606,743 · App. 15/143,802 · Granted Mar 28, 2017

Semiconductor memory device and driving method of the same

Inventor: Ryousuke Takizawa (Kanagawa, JP)
Assignee: Kabushiki Kaisha Toshiba
G06F3/0625G06F3/0634G06F3/0658G06F3/0659G06F3/0673G11C5/148G11C11/15G11C11/16G11C11/1697G11C5/14G11C5/143G11C5/144
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Quick Facts
Patent No.
US 9,606,743
App. No.
15/143,802
Granted
Mar 28, 2017
Kind
B2
Abstract

A non-volatile semiconductor memory device that can reduce power consumption includes plural memory banks containing nonvolatile plural memory cells. A common data bus is shared by plural memory banks and transmits the data of the memory cells. The plural switches are provided respectively between the electric source and plural memory banks. A controller controls the plural switches. The controller, in the data reading-out action or the data writing-in action, makes at least one of the switches corresponding to at least one of the memory banks accessible in a conduction state, and other switches in a non-conduction state.

Claims (31)

1. A system, comprising:

a chip controller; and

a magnetic random access memory (MRAM) including an interface circuitry, a first memory cell array, and a second memory cell array, wherein

the chip controller supplies a clock signal, a command/address signal, a data signal, and a data strobe signal to the MRAM,

the interface circuitry of the MRAM receives a first command and a second command from the chip controller by the command/address signal,

in response to the first command, the first memory cell array is coupled to a power source and the second memory cell array is decoupled from the power source, and

in response to the second command, the first and second memory cell arrays are decoupled from the power source.

2. The system according to claim 1 , wherein

the interface circuitry causes the first memory cell array to be coupled to the power source and the second memory cell array to be decoupled from the power source in response to the first command, and

the interface circuitry causes the first and second memory cell arrays to be decoupled from the power source in response to the second command.

3. The system according to claim 1 , wherein the chip controller includes a first mode register configured to store operation states of the MRAM.

4. The system according to claim 3 , wherein the MRAM includes a second mode register configured to store operation states of the MRAM.

5. The system according to claim 4 , further comprising a non-volatile register capable of storing data from the second mode register and supplying stored data to the second mode register.

6. The system according to claim 4 , wherein the first mode register is decoupled from the power source during a deep power down state and data stored in the second mode register is supplied to the first mode register after a command to end the deep power down state is received.

7. The system according to claim 6 , wherein the second mode register is coupled to the power source during the deep power down state.

8. The system according to claim 6 , wherein the second mode register is decoupled from the power source during the deep power down state and data from the second mode register is stored in a non-volatile register during the deep power down state.

9. The system according to claim 1 , wherein the MRAM includes a mode register configured to store operation states of the MRAM.

10. The system according to claim 9 , further comprising a non-volatile register capable of storing data from the mode register and supplying stored data to the mode register.

11. A semiconductor memory device, comprising:

a first memory cell array including a plurality of magnetic tunnel junction (MTJ) elements;

a second memory cell array including a plurality of MTJ elements;

an interface circuitry that is coupled to a clock signal, a command/address signal, a data signal, and a data strobe signal; and

a control circuitry that is coupled to a power source, the interface circuitry, and the first and second memory cell arrays, wherein

in a first operation state, the control circuitry causes the first memory cell array to be connected to the power source and to cause the second memory cell array to be disconnected from the power source, and

in a second operation state, the control circuitry causes both of the first and second memory cell arrays to be disconnected from the power source.

12. The semiconductor memory device according to claim 11 , wherein the first operation state is an active state or an idle state.

13. The semiconductor memory device according to claim 12 , wherein the second operation state is a deep power down state.

14. The semiconductor memory device according to claim 11 , wherein the control circuitry comprises first and second switches, the first switch being coupled between the first memory cell array and the power source, and the second switch being coupled between the second memory cell array and the power source.

15. The semiconductor memory device according to claim 11 , further comprising a first mode register configured to store operation states of the semiconductor memory device.

16. The semiconductor memory device according to claim 15 , further comprising a second mode register configured to store operation states of the semiconductor memory device.

17. The semiconductor memory device according to claim 16 , further comprising a non-volatile register capable of storing data from the second mode register and supplying stored data to the second mode register.

Assignments (4)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0647 →
Priority Claims (1)
JP 2012-065370 · Mar 22, 2012 · national
Continuity (3)
Continuation 14665680 · Mar 23, 2015
Continuation 13606793 · Sep 7, 2012
Related Publication 20160246531A1 · Aug 25, 2016