Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith

1. A consumer electronic article of manufacture comprising:

a housing comprising at least one housing substrate having an interior surface and an exterior surface;

a combination comprising a composition and a substrate on which the composition is disposed, the composition comprising a matrix and encapsulated phase change material particles dispersed therein, wherein:

the matrix comprises a pressure sensitive adhesive or an acrylic emulsion,

the encapsulated phase change material has a melting point in the range of about 30° C. to about 100° C.,

the composition comprises:

about 10 to about 80% by volume of the matrix and

about 20 to about 90% by volume of the encapsulated phase change material,

the substrate is selected from the group consisting of a metallic, a metal-coated polymeric, a graphite or a metal-coated graphitic substrate, on which the composition is disposed, and wherein the combination is disposed on at least a portion of the interior surface of the at least one housing substrate; and

at least one semiconductor package comprising an assembly comprising at least one of

I.

a semiconductor chip;

a heat spreader; and

a thermal interface material therebetween, or

II.

a heat spreader;

a heat sink; and

a thermal interface material therebetween.

2. The article of claim 1 , further comprising a venting element to disperse generated heat from the semiconductor assembly from the article.

3. The article of manufacture of claim 1 , wherein the housing comprises at least two substrates.

4. The article of manufacture of claim 1 , wherein the housing comprises a plurality of substrates.

5. The article of manufacture of claim 1 , wherein the substrates are dimensioned and disposed to engage one another.

6. The article of manufacture of claim 1 , wherein the composition is disposed on at least a portion of the interior surface of the at least one housing substrate, the complementary exterior surface of which comes into contact with the end user when in use.

7. The article of manufacture of claim 1 , wherein the composition further comprises thermally insulating materials.

8. The article of manufacture of claim 7 , wherein the thermally insulating materials in the composition comprise a gas.

9. The article of manufacture of claim 7 , wherein the thermally insulating materials in the composition comprise air.

10. The article of manufacture of claim 7 , wherein the thermally insulating materials in the composition comprise a gas within a hollow sphere-like vessel.

11. The article of manufacture of claim 7 , wherein the thermally insulating materials are used at a concentration within the range of 25% to 99% by volume in the composition.

12. The article of manufacture of claim 1 , wherein the composition facilitates the transfer of heat from an electronic component to a heat sink.

13. The article of manufacture of claim 1 , wherein the thermal interface material has a melting point of approximately 37° C.

14. The article of manufacture of claim 1 , wherein the encapsulated phase change material has a melting point of approximately 37° C.

15. The article of manufacture of claim 1 , wherein the thermal interface material has a melting point of approximately 52° C.

16. The article of manufacture of claim 1 , wherein the encapsulated phase change material has a melting point of approximately 52° C.

17. The article of manufacture of claim 1 , wherein the article is a notebook personal computer, tablet personal computer or a handheld device.