Semiconductor component and method of producing a semiconductor component
A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.
1. A method of producing a semiconductor component comprising:
a) providing an optoelectronic semiconductor chip;
b) applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material;
c) precuring the molding compound at a temperature of at most 50° C.; and
d) curing the molding compound.
2. The method according to claim 1 , wherein the precuring is induced by electromagnetic radiation.
3. The method according to claim 2 , wherein the molding compound is exposed to radiation with an energy input of 0.2 J/cm 2 to 2.0 J/cm 2 in step c).
4. The method according to claim 1 , wherein the molding compound is activated by mixing at least two components of the molding compound in step c).
5. The method according to claim 1 , wherein step d) is carried out at a higher temperature than step c).
6. The method according to claim 1 , wherein thermal curing is carried out in step d).