IP Library Granted Patent US 10,181,551
Granted Patent B2
US 10,181,551 · App. 15/150,020 · Granted Jan 15, 2019

LED using luminescent sapphire as down-converter

Inventor: Gregoire Francois Florent Denis (San Jose, CA)
Assignee: Lumileds LLC
H01L33/504H01L33/0075H01L33/0095H01L33/025H01L33/32H01L33/502H01L33/505H01L33/507H01L33/54H01L33/007H01L2933/005H01L2933/0041H01L2933/0083
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Quick Facts
Patent No.
US 10,181,551
App. No.
15/150,020
Granted
Jan 15, 2019
Kind
B2
Abstract

An LED die includes a luminescent sapphire layer affixed to LED semiconductor layers. The luminescent sapphire absorbs a portion of the primary light and down-converts the primary light to emit secondary light. A phosphor layer may be added. The luminescent sapphire may comprise luminescent sapphire particles in a binder forming a mixture deposited over the LED semiconductor layers. Alternatively, the luminescent sapphire comprises a pre-formed tile that is affixed over the LED semiconductor layers. Alternatively, the luminescent sapphire comprises a luminescent sapphire growth substrate on which is epitaxially grown the LED semiconductor layers. After the LED die is formed, the luminescent characteristics of the sapphire may be adjusted using optical conditioning and/or annealing to tune the die's overall emission.

Claims (22)

1. A light emitting device comprising:

light emitting diode (LED) semiconductor layers comprising an N-type layer, an active layer configured to emit a primary light, and a P-type layer; and

luminescent sapphire distinct from a growth substrate for the semiconductor layers, the luminescent sapphire being affixed over a light emitting surface of the LED semiconductor layers,

the LED semiconductor layers and the luminescent sapphire forming part of an LED die, the luminescent sapphire containing oxygen vacancies resulting in F-like centers having defined optical absorption and luminescence emission bands,

the luminescent sapphire configured to absorb a portion of the primary light and down-converts the primary light to emit secondary light, via the F-like centers, such that an emission from the LED die includes at least a combination of the primary light and the secondary light.

2. A light emitting device, comprising:

light emitting diode (LED) semiconductor layers comprising an N-type layer, an active layer configured to emit a primary light, and a P-type layer; and

luminescent sapphire distinct from a growth substrate for the semiconductor layers, the luminescent sapphire being affixed over a light emitting surface of the LED semiconductor layers,

the luminescent sapphire containing oxygen vacancies resulting in F-like centers having defined optical absorption and luminescence emission bands,

the luminescent sapphire comprising luminescent sapphire particles combined with a binder to form a mixture, the mixture being located overlying the light emitting surface of the LED semiconductor layers.

3. The device of claim 2 wherein the luminescent sapphire is a pre-formed tile laminated over the semiconductor layers.

4. The device of claim 2 wherein the luminescent sapphire is a molded element over the semiconductor layers.

5. The device of claim 2 wherein the mixture is located directly on one of the LED semiconductor layers.

6. The device of claim 1 wherein the luminescent sapphire comprises a pre-formed tile that is affixed over the light emitting surface of the LED semiconductor layers.

7. The device of claim 6 wherein the tile comprises a single crystal of the luminescent sapphire.

8. The device of claim 6 wherein the tile comprises luminescent sapphire particles in a binder.

9. The device of claim 6 wherein the tile is directly affixed to one of the LED semiconductor layers with an adhesive layer.

10. The device of claim 1 wherein the N-type layer, the active layer, and the P-type layer are epitaxially grown over a sapphire growth substrate, which is distinct from the luminescent sapphire.

11. The device of claim 1 further comprising a phosphor layer overlying the LED semiconductor layers as part of the LED die, such that a light emission of the LED die comprises the primary light, the secondary light from the luminescent sapphire, and light from the phosphor layer.

12. The device of claim 11 wherein the luminescent sapphire comprises luminescent sapphire particles combined with a binder to form a mixture, wherein the mixture is located overlying the light emitting surface of the LED semiconductor layers, and wherein the phosphor is part of the mixture.

13. The device of claim 12 wherein the primary light is blue light, and the secondary light and light from the phosphor include green and red light.

14. The device of claim 11 wherein the primary light, the secondary light from the luminescent sapphire, and the light from the phosphor layer create white light.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2018
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 045583/0685 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2018
From: DENIS, GREGOIRE FRANCOIS FLORENT
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 045086/0647 →
Continuity (4)
Division 14761115
Provisional Application 61831244 · Jun 5, 2013
Provisional Application 61753175 · Jan 16, 2013
Related Publication 20160254420A1 · Sep 1, 2016