Printed circuit board including differential transmission lines thereon and having a conductive structure which provides immunity to common-mode noise
A design for printed circuit board with reduced susceptibility to common-mode noise includes a first substrate, a differential pair of signal lines with two differential transmission lines laid on the first substrate, a second substrate, a metal layer located between the first substrate and the second substrate, and a grounding layer The second substrate is located between the second substrate and the grounding layer, and a conductive structure is located in the second substrate and couples the metal layer to the grounding layer. A length of the metal layer is substantially equal to a length of each of the two differential transmission lines.
1. A printed circuit board comprising:
a first substrate;
a differential pair signal lines with two differential transmission lines laid on the first substrate;
a second substrate;
a metal layer located between the first substrate and the second substrate;
a grounding layer, and the second substrate is located between the metal layer and the grounding layer; and
a conductive structure located in the second substrate and coupling the metal layer to the grounding layer;
wherein a length of the metal layer is substantially equal to a length of each of the two differential transmission lines; and
a width of the metal layer is substantially equal to a width of each of the two differential transmission lines plus a distance between the two differential transmission lines.
2. The printed circuit board of claim 1 , wherein each of the two differential transmission lines extends in a first direction, and the metal layer extends in the first direction.
3. The printed circuit board of claim 2 , wherein the conductive structure extends in a second direction, which is substantially perpendicular to the first direction.
4. The printed circuit board of claim 1 , wherein each of the first substrate and the second substrate is an insulating substrate.
5. The printed circuit board of claim 1 , wherein the first substrate has a first surface and a second surface opposite to the first surface, and the second substrate has third surface and a fourth surface opposite to the third surface; the metal layer is sandwiched between the second surface and the third surface, and the grounding layer is attached to the fourth surface.
6. The printed circuit board of claim 5 , wherein the metal layer is rectangular in shape and symmetrical with respect to a centerline defined between the two differential transmission lines.
7. The printed circuit board of claim 6 , wherein the conductive structure is a via hole.
8. The printed circuit board of claim 7 , wherein the via hole is located between the two differential transmission lines.
9. The printed circuit board of claim 8 , wherein the via hole is symmetrical with respect to the centerline.
10. A printed circuit board comprising:
a first substrate;
a differential pair signal lines with two differential transmission lines laid on the first substrate;
a second substrate;
a metal layer located between the first substrate and the second substrate;
a grounding layer, and the second substrate is located between the metal layer and the grounding layer; and
a conductive structure located in the second substrate and coupling the metal layer to the grounding layer;
wherein each of the two differential transmission lines extends in a first direction, and the metal layer extends in the first direction and is symmetrical with respect to a centerline defined between the two differential transmission lines;
a length of the metal layer is substantially equal to a length of each of the two differential transmission lines; and
a width of the metal layer is substantially equal to a width of each of the two differential transmission lines plus a distance between the two differential transmission lines.
11. The printed circuit board of claim 10 , wherein the conductive structure extends in a second direction, which is substantially perpendicular to the first direction.
12. The printed circuit board of claim 10 , wherein each of the first substrate and the second substrate is an insulating substrate.
13. The printed circuit board of claim 10 , wherein the first substrate has a first surface and a second surface opposite to the first surface, and the second substrate has third surface and a fourth surface opposite to the third surface; the metal layer is sandwiched between the second surface and the third surface, and the grounding layer is attached to the fourth surface.
14. The printed circuit board of claim 13 , wherein the metal layer is rectangular in shape.
15. The printed circuit board of claim 14 , wherein the conductive structure is a via hole.
16. The printed circuit board of claim 15 , wherein the via hole is located between the two differential transmission lines.
17. The printed circuit board of claim 16 , wherein the via hole is symmetrical with respect to the centerline.