IP Library Granted Patent US 9,849,655
Granted Patent B2
US 9,849,655 · App. 15/158,879 · Granted Dec 26, 2017

Adhesive for insulative articles

Inventors: Tianjian Huang (Hillsborough, NJ); Kristina Thompson (Clinton, NJ); Daniel Waski (Elmhurst, IL); Kris Getty (Deerfield, IL)
Assignee: HENKEL IP & HOLDING GMBH
B32B29/002B32B7/12B32B21/04B32B29/08C09J109/06C09J123/08C09J125/14C09J129/04C09J131/04C09J133/06C09J133/062C09J133/08C09J175/04D21H19/12D21H21/54B32B2255/08B32B2255/12B32B2255/26B32B2307/51B32B2307/54B32B2439/00B32B2439/70
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Quick Facts
Patent No.
US 9,849,655
App. No.
15/158,879
Granted
Dec 26, 2017
Kind
B2
Abstract

An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.

Claims (32)

1. A waterborne-based adhesive comprising:

(a) a water-based polymer prepared by emulsion polymerization;

(b) a plurality of expandable microspheres; and

(c) optionally, an additive;

wherein the water-based polymer has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.

2. The waterborne-based adhesive of claim 1 , wherein the water-based polymer has (i) modulus of 5 MPa at 85° C. to 100° C.

3. The waterborne-based adhesive of claim 1 , wherein the water-based polymer is selected from the group consisting of emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof.

4. The waterborne-based adhesive of claim 1 , wherein the expandable microspheres have a hydrocarbon core and a polyacrylonitrile shell.

5. The waterborne-based adhesive of claim 1 , wherein the expandable microspheres begin to expand at a temperature of about 80° C. to about 100° C.

6. The waterborne-based adhesive of claim 1 , wherein the expandable microspheres have a maximum expansion temperature of about 120° C. to about 130° C.

7. The waterborne-based adhesive of claim 1 , further comprising a crosslinker, defoamer, preservative, surfactant, rheology modifier, filler, pigment, dye, stabilizer, polyvinyl alcohol, humectant, and mixtures thereof.

8. The waterborne-based adhesive of claim 1 , wherein the additive is selected from the group consisting of tackifiers, plasticizers, crosslinker, and mixtures thereof.

9. The waterborne-based adhesive of claim 8 , wherein the crosslinker is selected from the group consisting of aluminum nitrate, zirconium acetate, ammonium zirconyl carbonate and mixtures thereof.

10. The waterborne-based adhesive composition of claim 1 , wherein the adhesive further comprises an accelerator that is a multivalent water-soluble salt.

11. The waterborne-based adhesive composition of claim 10 , wherein the multivalent water-soluble salt is selected from the group consisting of aluminum nitrate, zirconium acetate, ammonium zirconyl carbonate and mixtures thereof.

12. A process for forming an article comprising the steps of:

(a) preparing a composition comprising:

(1) a water-based polymer prepared by emulsion polymerization that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.; and

(2) a plurality of expandable microspheres;

(b) applying the composition onto a substrate, which is a paper, paperboard or wood;

(c) drying the composition to substantially remove the water; and

(d) expanding the composition.

13. The process of claim 12 , wherein steps (c) and (d) are simultaneously combined.

14. The process of claim 12 , wherein the composition is applied in a pattern.

15. The process of claim 14 , wherein the pattern is a series of dots, stripes, waves, checkerboards, or a polyhedron shape that have substantially a flat base.

16. An article comprising a cellulosic substrate and a composition comprising:

(a) a water-based polymer prepared by emulsion polymerization that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.; and

(b) a plurality of expandable microspheres.

17. The article of claim 16 , wherein the water-based polymer is selected from the group consisting of emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof.

18. The article of claim 17 , wherein the cellulosic substrate is a fiberboard, corrugated board, solid bleached boards, kraft paper or coated paper.

19. The article of claim 16 is a multilayer substrate.

20. The multilayer substrate of claim 19 is a cup, food container, case, carton, bag, box, lids, envelope, wrap or clamshell.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2017
From: HUANG, TIANJIAN; THOMPSON, KRISTINA; WASKI, DANIEL; GETTY, KRIS
To: HENKEL CORPORATION
Reel/Frame 044372/0074 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2017
From: HENKEL CORPORATION
To: HENKEL IP & HOLDING GMBH
Reel/Frame 044372/0151 →
Continuity (3)
Continuation PCTUS2014067408 · Nov 25, 2014
Provisional Application 61909723 · Nov 27, 2013
Related Publication 20160263876A1 · Sep 15, 2016