Techniques for joining one or more structures of an electronic device
Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.
1. An electronic device, comprising:
a base portion;
a magnet bonded to the base portion by a solder material;
a housing rotatably coupled with the base portion and formed from a first type of metal; and
an attachment feature formed from a second type of metal different from the first type of metal and secured to the housing via a diffusion bond, wherein in a closed configuration between the base portion and the housing, the second type of metal causes the attachment feature to magnetically couple with the magnet to define a magnetic circuit.
2. The electronic device of claim 1 , wherein:
the electronic device further comprises a protruding feature bonded with the housing; and
the protruding feature comprises an internal threaded region to secure a component with the housing.
3. The electronic device of claim 2 , further comprising an intermediate feature, wherein the intermediate feature is directly bonded with the protruding feature and the housing.
4. The electronic device of claim 1 , wherein:
the electronic device further comprises a beam feature bonded directly with the housing; and
the beam feature extends along an interior region of the housing to provide structural support to the housing.
5. The electronic device of claim 4 , wherein the electronic device further comprises a cable assembly, and wherein the cable assembly extends through an underpass of the beam feature.
6. The electronic device of claim 4 , wherein the beam feature is bonded to a top wall of the housing via a diffusion bond.
7. The electronic device of claim 6 , wherein a thickness of the housing is 1 mm or less at the diffusion bond.
8. The electronic device of claim 1 , wherein the electronic device is a laptop computer.
9. The electronic device of claim 1 , wherein the base portion comprises aluminum or an aluminum alloy.
10. The electronic device of claim 9 , wherein the magnet is at least partially disposed in a channel formed in a sidewall of the base portion.
11. The electronic device of claim 2 , wherein the protruding feature is bonded to a top wall of the housing via a diffusion bond.
12. The electronic device of claim 11 , wherein a thickness of the housing is 1 mm or less at the diffusion bond.