HIGH-FREQUENCY ANTENNA STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND HIGH SURFACE AREA
A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array. An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.
1 - 20 . (canceled)
21 . An apparatus comprising:
a substrate;
at least one integrated circuit attached to the substrate;
an antenna attached to the at least one integrated circuit; and
a first heat spreader attached to the antenna.
22 . The apparatus of claim 21 further comprising a second heat spreader attached to the substrate.
23 . The apparatus of claim 21 further comprising at least one electrical component attached to the substrate.
24 . The apparatus of claim 21 , wherein the first heat spreader is attached to the antenna using a heat conductive epoxy.
25 . The apparatus of claim 21 , wherein the first heat spreader is a parallel plate heat spreader.
26 . The apparatus of claim 21 , wherein the first heat spreader is a flat plate heat spreader.
27 . The apparatus of claim 21 , wherein the first heat spreader is a parallel pillar heat spreader.
28 . The apparatus of claim 21 , wherein the first heat spreader is composed of dielectric material.
29 . The apparatus of claim 28 , wherein the dielectric material is one of aluminum nitride, beryllium oxide, aluminum oxide, silicon carbide, and boron nitride.
30 . The apparatus of claim 21 , wherein the at least one integrated circuit is one of a radio frequency chip and a baseband chip.
31 . The apparatus of claim 22 , wherein the second heat spreader is one of a parallel plate heat spreader, a flat plate heat spreader, and a parallel pillar heat spreader.
32 . The apparatus of claim 22 , wherein the second heat spreader is composed of dielectric material.
33 . An apparatus comprising:
a substrate;
at least one integrated circuit attached to the substrate; and
an antenna structure attached to the at least one integrated circuit, the antenna structure comprising:
an antenna; and
a first heat spreader electrically connected to the antenna.
34 . The apparatus of claim 33 further comprising a second heat spreader attached to the substrate.
35 . The apparatus of claim 33 further comprising at least one electrical component attached to the substrate.
36 . The apparatus of claim 33 , wherein the first heat spreader is composed of dielectric material.
37 . The apparatus of claim 36 , wherein the dielectric material is one of aluminum nitride, beryllium oxide, aluminum oxide, silicon carbide, and boron nitride.
38 . The apparatus of claim 33 , wherein the antenna structure comprises an array of antennas.
39 . An apparatus comprising:
a substrate;
at least one integrated circuit attached to the substrate;
an antenna attached to the at least one integrated circuit; and
a first heat spreader directly attached to the antenna using a conductive epoxy.
40 . The apparatus of claim 39 further comprising a second heat spreader attached to the substrate.