SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE
The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a plurality of leads arranged between the suspension leads; a semiconductor chip mounted on the chip supporting surface of the tab, the semiconductor chip including a main surface, a plurality of pads formed on the main surface, and a rear surface opposite to the main surface; a seal portion sealing the semiconductor chip such that a part of each of the leads is exposed from the seal portion; and a Pb-free solder formed on the part of each of the leads. A part of the rear surface of the semiconductor chip is contacted with the seal portion.
1 . A semiconductor device comprising a tub supported by a plurality of suspension leads, a plurality of leads disposed to surround periphery of said tub, a semiconductor chip mounted on one principal surface of said tub and electrically connected to one principal surface of said plurality of leads and a sealing resin for sealing said plurality of leads and said semiconductor chip plus said tub, characterized in that a remaining principal surface opposite to said one principal surface of said plurality of leads is exposed from said sealing resin and that said tub