Method of forming a light-emitting device
A method of forming a light-emitting device. The light-emitting device includes a first optoelectronic unit, a second optoelectronic unit, a fence, and a cover. The first optoelectronic unit has a first side surface. The second optoelectronic unit is apart from the first optoelectronic unit and has a second side surface. The fence surrounds the first side surface and the second side surface. The cover is on the first optoelectronic unit and the fence.
1. A method of forming a light-emitting device, comprising:
arranging a first optoelectronic unit with a first side surface and a second optoelectronic unit with a second side surface on a carrier, wherein the second optoelectronic unit is spaced apart from the first optoelectronic unit;
forming a fence on the carrier, wherein the fence comprises a plastic and surrounds the first side surface and the second side surface;
forming a cover on the first optoelectronic unit and the fence; and
removing the carrier from the first optoelectronic unit and the second optoelectronic unit, and exposing bottom surfaces of the first optoelectronic unit and the second optoelectronic unit,
wherein the cover is not directly connected to the first optoelectronic unit when the cover is formed on the first optoelectronic unit.
2. The method of claim 1 , wherein the cover comprises a transparent material.
3. The method of claim 1 , wherein the cover comprises a plurality of transparent material.
4. The method of claim 1 , wherein the fence comprises a non-transparent material.
5. The method of claim 1 , wherein the fence comprises a light-absorbing material.
6. The method of claim 1 , further comprising a step of arranging a third optoelectronic unit on the carrier, wherein no other optoelectronic unit is arranged between either two of the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit.
7. The method of claim 1 , further comprising a step of forming a wavelength converting layer on the first optoelectronic unit and the second optoelectronic unit, wherein the wavelength converting layer is placed between the cover and the first optoelectronic unit.
8. The method of claim 7 , wherein the wavelength converting layer is formed in a strip shape.
9. The method of claim 1 , wherein the first optoelectronic unit comprises a pair of electrodes on the bottom surface.
10. The method of claim 9 , further comprising a step of forming a pin on at least one of the pair of electrodes.
11. The method of claim 1 , wherein the fence comprises a black coating mixed with the plastic.
12. The method of claim 6 , wherein the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit are arranged in a linear configuration.
13. The method of claim 6 , wherein the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit are arranged in a triangular configuration.
14. The method of claim 1 , wherein the first optoelectronic unit and the second optoelectronic unit are configured to emit different color lights.
15. The method of claim 1 , wherein the light-emitting device further comprising a spacing between the cover and the first optoelectronic unit when the cover is formed on the first optoelectronic unit.
16. The method of claim 1 , wherein the cover, the fence and the carrier are assembled in a close loop in a cross sectional view before removing the carrier.
17. The method of claim 1 , further comprising the step of forming a first supporting structure on the first optoelectronic unit before forming the cover on the first optoelectronic unit.
18. The method of claim 17 , wherein the first supporting structure comprises a material different from that of the cover.
19. The method of claim 17 , further comprising the step of forming a pin on the first supporting structure in a position opposite to the cover.