Extreme durability composite diamond film
A novel composite diamond film comprising of a relatively thick layer of UNCD (Ultrananocrystalline Diamond) with a Young's modulus of less than 900 GPa and a relatively thin MCD (microcrystalline diamond) outermost layer with a Young's modulus of greater than 900 GPa, has been shown to exhibit superior delamination resistance under extreme shear stress. It is hypothesized that this improvement is due to a combination of stress relief by the composite film with a slightly “softer” UNCD layer, a disruption of the fracture mechanism through the composite layer(s), and the near ideal chemical and thermal expansion coefficient match between the two diamond layers. The combination of a thick but “softer” underlying UNCD layer with a thin but harder overlying MCD layer provides an excellent compromise between the low deposition cost and smoothness of UNCD with the extreme hardness and unparalleled chemical, electrochemical and immunological inertness of even a thin layer of MCD. The MCD layer's roughness is minimized and its adhesion maximized by the use of a thin layer of MCD and its deposition on the smooth surface of the chemically nearly identical underlying UNCD layer. The composite film can be applied to any application currently utilizing a diamond or a similar hard film, including cutting tools, abrasive surfaces, electrochemistry, biomedical applications such as human implants or thermally conductive films and the like, requiring superior durability, chemical resistance and/or immunological inertness.
1. A composite diamond film disposed on a substrate comprising: at least a first underlying diamond layer comprising ultrananocrystalline diamond having a first average thickness and an average sp 2 carbon content said first underlying diamond layer being deposited directly onto at least one side of the substrate and a second outermost diamond layer having a second average thickness and an average sp 2 carbon content said second outermost diamond layer being deposited directly onto the first underlying diamond layer, wherein the thickness of the first underlying diamond layer is at least 2 times thicker than the second outermost diamond layer and sp 2 carbon content of the first underlying diamond layer is at least five times greater than the sp 2 carbon content of the second outermost diamond layer.
2. The composite diamond film of claim 1 , wherein the second outermost layer is a polycrystalline diamond layer.
3. The composite diamond film of claim 1 , wherein the first underlying diamond layer has an average grain size of less than 10 nm and the second outermost diamond layer has an average grain size of greater than 50 nm.
4. The composite diamond film of claim 3 , wherein the second outermost diamond layer has an average grain size of greater than 100 nm.
5. The composite diamond film of claim 1 , wherein the grain size increases from the first underlying diamond layer to the second outermost diamond layer at an interface in between.
6. The composite diamond film of claim 1 , wherein the average thickness of the first underlying diamond layer is between 1 micron and 20 microns.
7. The composite diamond film of claim 6 , wherein the average thickness of the first underlying diamond layer is between 2 microns and 10 microns.
8. The composite diamond film of claim 1 , wherein the average thickness of the second outermost diamond layer is between 1 micron and 5 microns.
9. The composite diamond film of claim 1 , wherein the first underlying diamond layer has an average Young's modulus of less than 900 GPa.
10. The composite diamond film of claim 1 , wherein the second outermost diamond layer has an average Young's modulus of greater than 900 GPa.
11. The composite diamond film of claim 1 , wherein the first underlying diamond layer has an average Young's modulus of less than 800 GPa.
12. The composite diamond film of claim 1 , wherein the second outermost diamond layer has an average Young's modulus of greater than 1000 GPa.
13. The composite diamond film of claim 1 , wherein the average thickness of the first underlying diamond layer is at least five times thicker than the average thickness of the second outermost diamond layer.
14. The composite diamond film of claim 1 , where a diamond orientation of the first underlying diamond layer and the second outermost diamond layer is same.
15. The composite diamond film of claim 1 , where a diamond orientation of the first underlying diamond layer and the second outermost diamond layer is different.
16. The composite diamond film of claim 1 , wherein the substrate is a non-diamond carbide forming material.
17. The composite diamond film of claim 16 , wherein the substrate comprises one or more of niobium, tantalum, tungsten, titanium, molybdenum, zirconium, silicon, silicon carbide, tungsten carbide, pyrolytic carbon or graphite and alloys and mixtures thereof.
18. The composite diamond film of claim 1 , wherein both the first underlying diamond layer and the second outermost diamond layer are electrically insulating.
19. The composite diamond film of claim 1 , wherein both the first underlying diamond layer and the second outermost diamond layer are electrically conductive.
20. The composite diamond film of claim 1 , wherein the first underlying diamond layer is electrically insulating and the second outermost diamond layer is electrically conductive.
21. The composite diamond film of claim 1 , wherein the first underlying diamond layer is electrically conductive and the second outermost diamond layer is electrically insulating.
22. The composite diamond film of claim 1 , wherein the second outermost diamond layer comprises microcrystalline diamond.
23. The composite diamond film of claim 1 , wherein both the first underlying diamond layer and the second outermost diamond layer are monolithic diamond layers.
24. The composite diamond film of claim 1 , wherein an average surface roughness of the second outermost diamond layer is less than 100 nm.
25. The composite diamond film of claim 1 , wherein the first underlying diamond layer has a deposited average roughness of less than 20 nm.
26. The composite diamond film of claim 1 , wherein the first underlying diamond layer has an average roughness of less than 1 nm.
27. The composite diamond film of claim 1 , wherein the first underlying diamond layer is coated on the substrate in the same deposition run as the second-outermost diamond layer coated on the first underlying diamond layer, without breaking reactor vacuum.
28. The composite diamond film of claim 1 , wherein the first underlying diamond layer is coated on the substrate in the first deposition run followed by the second outermost diamond layer coated on the first underlying diamond layer in the second deposition run separated from the first deposition run.
29. A composite diamond film, disposed on a substrate comprising: at least a first underlying diamond layer comprising ultrananocrystalline diamond having a first average thickness and an average sp 2 carbon content, said first underlying diamond layer being deposited directly onto at least one side of the substrate and a second diamond layer having a second average thickness and an average sp 2 carbon content and optionally comprising a third diamond layer deposited to the second layer and having a third average thickness and a third average sp 2 carbon content and a fourth diamond layer deposited to the third diamond layer having a fourth average thickness and a fourth average sp 2 carbon content, said second diamond layer being deposited directly onto the first underlying diamond layer, wherein the thickness of the first underlying diamond layer is at least 2 times thicker than the second diamond layer and sp 2 carbon content of the first underlying diamond layer is at least five times greater than the sp 2 carbon content of the second diamond layer, wherein the third sp 2 carbon content is approximately equal to the sp 2 carbon content of the first underlying diamond layer and the fourth sp 2 carbon content is approximately equal to the sp 2 carbon content of the second diamond layer.
30. The composite diamond film of claim 29 , wherein the third diamond layer comprises ultrananocrystalline diamond and the fourth diamond layer comprises microcrystalline diamond.
31. The composite diamond film of claim 29 , wherein the third average thickness of the third diamond layer is less than half of the first average thickness of the first underlying diamond layer.
32. The composite diamond film of claim 1 , wherein both a cohesive failure strength and an adhesive failure strength of the composite film is greater than a cohesive failure strength and an adhesive failure strength of a monolayer of diamond of approximately the same thickness as a cumulative thickness of both layers of the composite film.
33. The composite diamond film of claim 1 , wherein the composite diamond film is disposed on a material selected from the group consisting of a cutting tool, an abrasive surface, a thermally conductive instrument, a biomedical device or a biomedical implant.