Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
A microelectronic assembly ( 300 ) or system ( 1500 ) includes at least one microelectronic package ( 100 ) having a microelectronic element ( 130 ) mounted face up above a first surface ( 108 ) of a substrate ( 102 ), one or more columns ( 138, 140 ) of contacts ( 132 ) extending in a first direction ( 142 ) along the microelectronic element front face. Columns ( 104 A, 105 B, 107 A, 107 B) of terminals ( 105 107 ) exposed at a second surface ( 110 ) of the substrate extend in the first direction. First terminals ( 105 ) exposed at surface ( 110 ) in a central region ( 112 ) thereof having width ( 152 ) not more than three and one-half times a minimum pitch ( 150 ) of the columns of terminals can be configured to carry address information usable to determine an addressable memory location. An axial plane of the microelectronic element can intersect the central region.
1. A microelectronic package configured to be joined with contacts of a single component external to the microelectronic package, comprising:
a substrate having first and second opposed surfaces and substrate contacts exposed at the first surface, the substrate defining first, second, third, and fourth peripheral edges;
at least two stacks of semiconductor chips joined with the substrate in an area bounded by the first, second, third and fourth peripheral edges, each stack of semiconductor chips including an upper semiconductor chip and a lower semiconductor chip, the stacks of semiconductor chips being spaced apart from one another in a horizontal direction parallel to the first surface of the substrate, each semiconductor chip having a front face facing away from the first surface, a rear face opposite the front face, and contacts at the front face, the front face of each of the lower semiconductor chips being arranged parallel to the first surface, the rear face of each of the upper semiconductor chips at least partially overlying the front face of the lower semiconductor chip in its stack, and the semiconductor chips together configured to predominantly provide memory storage array function;
conductive structure extending above the front faces electrically connecting element contacts of each of the semiconductor chips of the at least two stacks of semiconductor chips with the substrate contacts; and
a plurality of terminals exposed at the second surface and electrically connected with the substrate contacts, the terminals including first and second groups of data terminals, each of the first and second groups having at least eight data terminals disposed on first and second opposite sides of an axis, respectively,
wherein each of the data terminals of the first and second groups are configured to carry data signals for read and write access to random access addressable memory locations of a memory storage array within one or more of the semiconductor chips, and the data terminals of the first group have modulo-X symmetry about the axis with the second group of the data terminals, wherein X is an integer, wherein X is greater than two.
2. The microelectronic package as claimed in claim 1 , wherein the at least two stacks of semiconductor chips includes four stacks of semiconductor chips.
3. The microelectronic package as claimed in claim 1 , wherein the conductive structure includes wire bonds extending from the element contacts and electrically connected with the substrate contacts.
4. The microelectronic package as claimed in claim 1 , wherein at least one of the upper semiconductor chips in the at least two stacks of semiconductor chips is electrically connected with a corresponding one of the lower semiconductor chips in the respective stack through the conductive structure.
5. The microelectronic package as claimed in claim 4 , wherein at least some of the electrical connections between the at least one of the upper semiconductor chips in the at least two stacks of semiconductor chips and the corresponding one of the lower semiconductor chips in the respective stack are through wire bonds extending between at least some of the element contacts of the at least one of the upper semiconductor chips and the corresponding one of the lower semiconductor chips in the respective stack.
6. The microelectronic package as claimed in claim 4 , wherein the at least one of the upper semiconductor chips in the at least two stacks of semiconductor chips is a plurality of upper semiconductor chips electrically connected with one another, and wherein at least some of the electrical connections between the plurality of upper semiconductor chips are through wire bonds.
7. The microelectronic package as claimed in claim 1 , wherein the element contacts of each semiconductor chip of the at least two stacks of semiconductor chips are arranged in at least one column of contacts disposed adjacent an edge of the respective front face, and each column of contacts of each of the lower semiconductor chips in the at least two stacks of semiconductor chips is disposed beyond an edge of the corresponding one of the upper semiconductor chips in the respective stack.
8. The microelectronic package as claimed in claim 1 , wherein the element contacts of each of the lower semiconductor chips of the at least two stacks of semiconductor chips include redistribution contacts exposed at the front face of the respective lower semiconductor chip, each redistribution contact being electrically connected with a contact pad of the respective lower semiconductor chip through at least one of a trace or a via, at least some of the redistribution contacts being displaced from the contact pads of the respective lower semiconductor chip in a direction along the front face of the lower semiconductor chip.
9. The microelectronic package as claimed in claim 1 , wherein the element contacts of each of the lower semiconductor chips of the at least two stacks of semiconductor chips are arranged in at least one column of contacts disposed adjacent an edge of the respective front face, and the at least one column of contacts of the lower semiconductor chip of a first stack of the at least two stacks of semiconductor chips is parallel to the at least one column of contacts of the lower semiconductor chip of a second stack of the at least two stacks of semiconductor chips.
10. The microelectronic package as claimed in claim 1 , wherein the front faces of the lower semiconductor chips of the at least two stacks of semiconductor chips are arranged in a single plane parallel to the first surface of the substrate.
11. The microelectronic package as claimed in claim 1 , wherein X is equal to 2 raised to the power of n, n being greater than or equal to 2.
12. The microelectronic package as claimed in claim 1 , wherein X is equal to N times 8, wherein N is a whole number greater than or equal to one.
13. The microelectronic package as claimed in claim 1 , further comprising data strobe terminals provided on the first and second sides of the axis, respectively, wherein the signal class assignment of the data strobe terminal on the first side of the axis is symmetric about the axis with the signal class assignment of the data strobe terminal on the second side of the axis.
14. The microelectronic package as claimed in claim 1 , further comprising data mask terminals provided on the first and second sides of the axis, respectively, wherein the signal class assignment of the data mask terminal on the first side of the axis is symmetric about the axis with the signal class assignment of the data mask terminal on the second side of the axis.
15. The microelectronic package as claimed in claim 1 , wherein the terminals further including other terminals disposed between the first and second groups of data terminals that are configured to carry signals other than the signals carried by the data terminals.
16. The microelectronic package as claimed in claim 15 , wherein the other terminals disposed between the first and second groups of data terminals are configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of the memory storage array.
17. The microelectronic package as claimed in claim 16 , wherein the other terminals disposed between the first and second groups of data terminals are configured to carry all of the address information usable by the circuitry within the microelectronic package to determine the addressable memory location.
18. The microelectronic assembly as claimed in claim 16 , wherein the other terminals disposed between the first and second groups of data terminals are configured to carry all of the command signals transferred to the microelectronic package, the command signals being write enable, row address strobe, and column address strobe signals.