Semiconductor light emitting device
A semiconductor light emitting device including an N-type semiconductor layer, a P-type semiconductor layer, a light emitting layer and a strain relief layer is provided. The light emitting layer is disposed between the N-type semiconductor layer and the P-type semiconductor layer, and the light emitting layer is a multiple quantum well structure. The strain relief layer is disposed between the light emitting layer and the N-type semiconductor layer, and is made of In x Ga 1-x N, where 0<x<1. The difference between any two values of x corresponded to any two positions in the strain relief layer is greater than −0.01 and less than 0.01. The thickness of the strain relief layer is larger than the thickness of each well layer of the multiple quantum well structure.
1. A semiconductor light emitting device, comprising:
an N-type semiconductor layer;
a P-type semiconductor layer;
a light emitting layer, disposed between the N-type semiconductor layer and the P-type semiconductor layer, wherein the light emitting layer is a multiple quantum well structure; and
a strain relief layer, disposed between the light emitting layer and the N-type semiconductor layer, and made of In x Ga 1-x N, wherein 0<x<1, a difference between any two values of x corresponded to any two positions in the strain relief layer is greater than −0.01 and less than 0.01, and a thickness of the strain relief layer is larger than a thickness of each well layer of the multiple quantum well structure.
2. The semiconductor light emitting device as claimed in claim 1 , wherein the thickness of the strain relief layer is 10 to 100 times the thickness of each well layer of the multiple quantum well structure.
3. The semiconductor light emitting device as claimed in claim 1 , wherein an indium content of the strain relief layer is lower than an indium content of each well layer of the multiple quantum well structure.
4. The semiconductor light emitting device as claimed in claim 3 , wherein each well layer of the multiple quantum well structure is made of In y Ga 1-y N, wherein 0<y<1, and 0.05≦y−x≦0.25.
5. The semiconductor light emitting device as claimed in claim 1 , wherein a thickness of a barrier layer that is the most adjacent to the N-type semiconductor layer in the multiple quantum well structure is larger than a thickness of a barrier layer that is the most adjacent to the P-type semiconductor layer in the multiple quantum well structure.
6. The semiconductor light emitting device as claimed in claim 1 , wherein the thickness of the strain relief layer is 5 to 50 times a thickness of a barrier layer that is the most adjacent to the N-type semiconductor layer in the multiple quantum well structure.
7. The semiconductor light emitting device as claimed in claim 1 , wherein the thickness of the strain relief layer is larger than a total thickness of the multiple quantum well structure.
8. The semiconductor light emitting device as claimed in claim 7 , wherein the thickness of the strain relief layer is 1.1 to 3 times a thickness of the multiple quantum well structure.
9. The semiconductor light emitting device as claimed in claim 1 , wherein the strain relief layer contains an N-type dopant, and a concentration of the N-type dopant of the strain relief layer is lower than a concentration of an N-type dopant of the N-type semiconductor layer.
10. The semiconductor light emitting device as claimed in claim 1 , wherein each well layer of the multiple quantum well structure is made of indium gallium nitride, and each barrier layer of the multiple quantum well structure is made of gallium nitride.