Polymer with a good heat resistance and storage stability, underlayer film composition containing the polymer and process for forming underlayer film using the composition

1. A polymer comprising a repeating unit represented by the following Chemical Formula 1:

in Chemical Formula 1,

Ar is (C6-C20)arylene;

R 1 to R 6 are each independently hydrogen, (C1-C20)alkyl, nitrile, or (C6-C20)arylmethyl, at least one of R 1 to R 6 being (C6-C20)arylmethyl;

L is a single bond, (C1-C10)alkylene, or (C6-C20)arylene, alkylene and arylene of L being further substituted with one or more substituents selected from (C1-C20)alkyl, (C6-C20)aryl, and (C1-C20)alkoxy; and

R′ and R″ are each independently hydrogen, (C1-C20)alkyl, (C1-C20)alkoxy, or (C6-C20)aryl, or are linked to each other via (C2-C10)alkenylene to form a fused ring.

2. The polymer of claim 1 , wherein the polymer has a weight average molecular weight of 500 to 20,000.

3. The polymer of claim 2 , wherein a substitution amount of (C6-C20)aralkyl in the polymer is 10 to 50 mol % based on the weight average molecular weight of the polymer.

4. The polymer of claim 1 , wherein Ar is phenylene, naphthylene, or anthrylene; R 1 to R 6 are each independently hydrogen, methyl, nitrile, benzyl, naphthylmethyl, anthrylmethyl, or pyrenylmethyl; L is a single bond,

R 11 and R 12 are each independently methyl, ethyl, propyl, or phenyl; and R′ and R″ are each independently hydrogen or are linked to each other via C4alkenylene to form a fused ring.

5. The polymer of claim 1 , wherein Ar is phenylene or naphthylene; R 1 to R 6 are each independently hydrogen or benzyl; L is

and R′ and R″ are each independently hydrogen or are linked to each other via C4alkenylene to form a fused ring.

6. An underlayer film composition for semiconductor and display manufacturing processes, the underlayer film composition comprising a polymer including a repeating unit represented by the following Chemical Formula 1:

in Chemical Formula 1,

Ar is (C6-C20)arylene;

R 1 to R 6 are each independently hydrogen, (C1-C20)alkyl, nitrile, or (C6-C20)arylmethyl, at least one of R 1 to R 6 being (C6-C20)arylmethyl;

L is a single bond, (C1-C10)alkylene, or (C6-C20)arylene, alkylene and arylene of L being further substituted with one or more substituents selected from (C1-C20)alkyl, (C6-C20)aryl, and (C1-C20)alkoxy; and

R′ and R″ are each independently hydrogen, (C1-C20)alkyl, (C1-C20)alkoxy, or (C6-C20)aryl, or are linked to each other via (C2-C10)alkenylene to form a fused ring.

7. The underlayer film composition of claim 6 , wherein a content of the polymer is 1 to 50 wt % based on total amount of the underlayer film composition.

8. The underlayer film composition of claim 6 , further comprising at least one additive selected from crosslinking agents, acid catalysts, acid generators, antifoaming agents, and surfactants.

9. The underlayer film composition of claim 8 , wherein the crosslinking agent is at least one selected from compounds represented by Chemical Formulas 2 to 8 below:

in Chemical Formula 4, R 21 and R 22 are each independently hydroxyl, (C1-C3)alkoxy, and R 23 is (C1-C10)alkyl,

in Chemical Formula 6, R 24 to R 27 are each independently hydroxyl or (C1-C3)alkoxy, and R 28 and R 29 are each independently hydrogen, (C1-C10)alkyl, or halo(C1-C10)alkyl,

in Chemical Formula 7, R 30 to R 33 are each independently hydroxyl or (C1-C3)alkoxy, and

in Chemical Formula 8, R 34 to R 39 are each independently hydroxyl or (C1-C3)alkoxy.

10. The underlayer film composition of claim 8 , wherein the acid catalyst or the acid generator is at least one selected from compounds represented by Chemical Formulas 9 to 14 below:

11. A method for forming an underlayer film for semiconductor and display manufacturing processes, the method comprising:

applying the underlayer film composition of claim 6 on a wafer; and

baking the wafer on which the underlayer film composition is applied.