Optical module and light source
An optical module and a light source are provided. The light source includes a circuit board, a plurality of light-emitting element chips, a plurality of total reflection elements, an encapsulant, and a plurality of optical wavelength conversion particles. The light-emitting element chips are disposed on the circuit board. Each of the light-emitting element chips is adapted to emit a light beam. The total reflection elements are disposed on the circuit board. Each of the total reflection elements is configured adjacent to one of the light-emitting element chips, a partial light beam of the light beam emitted by the one of the light-emitting element chips enters the total reflection element, and is transmitted in the total reflection element, and emits out from the total reflection element. The encapsulant covers the light-emitting element chips and the total reflection elements. The optical wavelength conversion particles are distributed in the encapsulant.
1. An optical module, comprising:
an optical plate, having a light incident surface; and
a light source, facing the light incident surface, and comprising:
a circuit board;
a plurality of light-emitting element chips, disposed on the circuit board, and each of the light-emitting element chips being adapted to emit a light beam;
a plurality of total reflection elements, disposed on the circuit board, and each of the total reflection elements being configured adjacent to one of the light-emitting element chips. wherein a partial light beam of the light beam emitted by the one of the light-emitting element chips enters the total reflection element, and the partial light beam is transmitted in the total reflection element in a total reflective manner, and emits out from the total reflection element;
an encapsulant, covering the light-emitting element chips and the total reflection elements; and
a plurality of optical wavelength conversion particles, distributed in the encapsulant.
2. The optical module as claimed in claim 1 , wherein the optical plate further has a light emitting surface, the light emitting surface is connected to the light incident surface, and the light source is not overlapped with the light emitting surface.
3. The optical module as claimed in claim 1 , wherein the optical plate further has a light emitting surface, the light emitting surface is opposite to the light incident surface, and the light source is overlapped with the light emitting surface.
4. The optical module as claimed in claim 1 , wherein each of the light-emitting element chips is a light-emitting diode (LED) chip.
5. The optical module as claimed in claim 1 , wherein the total reflection elements are respectively a single layer transparent structure, and a refractive index of each single layer transparent structure is higher than a refractive index of the encapsulant.
6. The optical module as claimed in claim 5 , wherein each of the single layer transparent structures has at least one of a plurality of bubbles and a plurality of diffusion particles therein.
7. The optical module as claimed in claim 1 , wherein the total reflection elements respectively comprise a first layer and a second layer, the first layer is located between the second layer and the circuit board, and a refractive index of the first layer is higher than a refractive index of the second layer.
8. The optical module as claimed in claim 7 , wherein the first layer has at least one of a plurality of bubbles and a plurality of diffusion particles therein.
9. The optical module as claimed in claim 7 , wherein the second layer has at least one opening, and the partial light beam emits out from the at least one opening.
10. The optical module as claimed in claim 7 , wherein the total reflection elements respectively further comprise a third layer, the third layer is located between the first layer and the circuit board, and the refractive index of the first layer is higher than a refractive index of the third layer.
11. The optical module as claimed in claim 1 , wherein two or more total reflection elements are disposed between two adjacent light-emitting element chips.
12. The optical module as claimed in claim 1 , wherein a shape of an orthogonal projection of each of the total reflection elements on the circuit board is a block, a bar, an arc or a ring.
13. The optical module as claimed in claim 1 , wherein an axial direction of the total reflection elements and the circuit board have an included angle therebetween.
14. A light source, comprising:
a circuit board;
a plurality of light-emitting element chips, disposed on the circuit board, and each of the light-emitting element chips being adapted to emit a light beam;
a plurality of total reflection elements, disposed on the circuit board, and each of the total reflection elements being configured adjacent to one of the light-emitting element chips, wherein a partial light beam of the light beam emitted by the one of the light-emitting element chips enters the total reflection element, and the partial light beam is transmitted in the total reflection element in a total reflective manner, and emits out from the total reflection element;
an encapsulant, covering the light-emitting element chips and the total reflection elements; and
a plurality of optical wavelength conversion particles, distributed in the encapsulant.
15. The light source as claimed in claim 14 , wherein each of the light-emitting element chips is a light-emitting diode (LED) chip.
16. The light source as claimed in claim 14 , wherein the total reflection elements are respectively a single layer transparent structure, and a refractive index of each single layer transparent structure is higher than a refractive index of the encapsulant.
17. The light source as claimed in claim 16 , wherein each of the single layer transparent structures has at least one of a plurality of bubbles and a plurality of diffusion particles therein.
18. The light source as claimed in claim 14 , wherein the total reflection elements respectively comprise a first layer and a second layer, the first layer is located between the second layer and the circuit board, and a refractive index of the first layer is higher than a refractive index of the second layer.
19. The light source as claimed in claim 18 , wherein the first layer has at least one of a plurality of bubbles and a plurality of diffusion particles therein.
20. The light source as claimed in claim 18 , wherein the second layer has at least one opening, and the partial light beam emits out from the at least one opening.
21. The light source as claimed in claim 18 , wherein the total reflection elements respectively further comprise a third layer, the third layer is located between the first layer and the circuit board, and the refractive index of the first layer is higher than a refractive index of the third layer.
22. The light source as claimed in claim 14 , wherein two or more total reflection elements are disposed between two adjacent light-emitting element chips.
23. The light source as claimed in claim 14 , wherein a shape of an orthogonal projection of each of the total reflection elements on the circuit board is a block, a bar, an arc or a ring.
24. The light source as claimed in claim 14 , wherein an axial direction of the total reflection elements and the circuit board have an included angle therebetween.
25. The light source as claimed in claim 14 , wherein a material of the encapsulant comprises epoxy or silicone.
26. The light source as claimed in claim 14 , wherein the optical wavelength conversion particles are phosphor powder or quantum dots.