IP Library Granted Patent US 9,766,668
Granted Patent B2
US 9,766,668 · App. 15/182,355 · Granted Sep 19, 2017

Forced and natural convection liquid cooler for personal computer

Inventors: Robert Michael Kinstle, III (Fremont, CA); Michael Hooper (Fremont, CA)
G06F1/20G06F1/183G06F2200/201
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Quick Facts
Patent No.
US 9,766,668
App. No.
15/182,355
Granted
Sep 19, 2017
Kind
B2
Abstract

A small form factor computer chassis is disclosed. The computer chassis includes a solid bulkhead that separates the computer chassis cavity into two thermal chambers. According to certain embodiments, a radiator that is oriented along the XZ plane and is along a wall of computer chassis helps remove heat from a liquid coolant arriving form a cold plate associated with a CPU and/or a GPU.

Claims (10)

1. A computer chassis comprising: a chassis frame encompassing a chassis cavity, the computer chassis having a top chassis portion oriented in a first X-Y plane of the computer chassis, a bottom chassis portion oriented in a second X-Y plane of the computer chassis, a front chassis portion oriented in a first Y-Z plane of the computer chassis, and a back chassis portion oriented in a second Y-Z plane of the computer chassis; a right side outer panel oriented in a first X-Z plane of the computer chassis; a left side outer panel oriented in a second X-Z plane of the computer chassis; a central solid bulkhead in the chassis cavity, the central solid bulkhead occupying and entire cross sectional area of the chassis cavity and is oriented in a third X-Z plane of the computer chassis, where the third X-Z plane is located about midway in a Y direction of the computer chassis, wherein: the central solid bulkhead runs from the top chassis portion to the bottom chassis portion and from the front chassis portion to the back chassis portion; the central solid bulkhead divides the chassis cavity into a first chassis cavity portion and a second chassis cavity portion, wherein the first chassis cavity portion forms a first thermal chamber of the computer chassis for housing a power supply unit, a motherboard and a corresponding central processing unit and the second chassis cavity portion forms a second thermal chamber of the computer chassis for housing a graphics processing unit connected to the first thermal chamber via a flexible cable; and convective forces in a positive Z direction carries heat from the bottom chassis portion to the top chassis portion.

2. The computer chassis of claim 1 , wherein the first chassis cavity portion is for housing a motherboard and a corresponding central processing unit associated with the motherboard.

3. The computer chassis of claim 1 , wherein the second chassis cavity portion is for housing a graphics processing unit.

4. The computer chassis of claim 1 , wherein the first chassis cavity portion is for housing a power supply unit.

5. The computer chassis of claim 1 , wherein the first chassis cavity portion is for housing a first radiator unit.

6. The computer chassis of claim 1 , wherein the second chassis cavity portion is for housing a second radiator unit.

7. The computer chassis of claim 5 , wherein the first radiator unit is associated with a pump to circulate coolant liquid from a heat source in the computer chassis to the first radiator unit, wherein the coolant liquid removes heat from the heat source and the coolant liquid is cooled at the first radiator unit.

8. The computer chassis of claim 6 , wherein the second radiator unit is associated with a pump to circulate coolant liquid from a heat source in the computer chassis to the second radiator unit, wherein the coolant liquid removes heat from the heat source and the coolant liquid is cooled at the second radiator unit.

9. The computer chassis of claim 1 , further comprising at least one exhaust fan located at the top chassis portion, wherein the at least one exhaust fan pulls air out of the first and second thermal chambers of the computer chassis.

10. The computer chassis of claim 1 , wherein the bottom chassis portion allows air from outside the computer chassis to flow into the computer chassis.

Assignments (6)
TERMINATION AND RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 7, 2021
From: MACQUARIE CAPITAL FUNDING LLC
To: CORSAIR MEMORY, INC.; ORIGIN PC, LLC
Reel/Frame 057424/0357 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 3, 2021
From: CORSAIR MEMORY, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 057407/0001 →
TERMINATION AND RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY RECORDED AT REEL 043714, FRAME 0171 Recorded Sep 4, 2020
From: MACQUARIE CAPITAL FUNDING LLC
To: CORSAIR MEMORY INC.; ORIGIN PC, LLC
Reel/Frame 053706/0930 →
SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Aug 29, 2017
From: CORSAIR MEMORY, INC.
To: MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT
Reel/Frame 043714/0171 →
FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Aug 29, 2017
From: CORSAIR MEMORY, INC.
To: MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT
Reel/Frame 043967/0980 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2016
From: KINSTLE, ROBERT MICHAEL, III; HOOPER, MICHAEL
To: CORSAIR MEMORY, INC.
Reel/Frame 039009/0783 →
Continuity (2)
Provisional Application 62208512 · Aug 21, 2015
Related Publication 20170052576A1 · Feb 23, 2017