Approach to measuring strain effects using ring oscillators
A ring oscillator system for characterizing substrate strain including, a substrate including a through-substrate-via, at least two ring oscillators, wherein a first ring oscillator is closer to the through-substrate-via than a second ring oscillator, and a logic difference circuit that is configured to receive an input from at least the first ring oscillator and the second ring oscillator, and detect a difference between the signal frequency of the first ring oscillator and the signal frequency of the second ring oscillator.
1. A ring oscillator system for characterizing substrate strain, comprising:
a substrate including a through-substrate-via;
at least two ring oscillators, wherein a first ring oscillator is closer to the through-substrate-via than a second ring oscillator; and
a logic difference circuit that is configured to receive an input from at least the first ring oscillator and the second ring oscillator, and detect a difference between the signal frequency of the first ring oscillator and the signal frequency of the second ring oscillator.
2. The ring oscillator system of claim 1 , wherein each of the at least two ring oscillators comprise the same odd number of inverter devices.
3. The ring oscillator system of claim 1 , wherein the first ring oscillator and the second ring oscillator form concentric circles around the through-substrate-via, where the first ring oscillator is closer to the edge of the through-substrate-via than the second ring oscillator.
4. The ring oscillator system of claim 3 , wherein the first ring oscillator is in the range of about 10 μm to about 30 μm from the edge of the through-substrate-via, and the second ring oscillator is in the range of about 50 μm to about 100 μm from the edge of the through-substrate-via.
5. The ring oscillator system of claim 1 , wherein the first ring oscillator and the second ring oscillator are parallel, and the first ring oscillator is closer to the edge of the through-substrate-via than the second ring oscillator.
6. The ring oscillator system of claim 5 , wherein the first ring oscillator and the second ring oscillator include one or more long channel, p-doped channel MOSFETs.
7. The ring oscillator system of claim 6 , wherein the closest point of the first ring oscillator is in the range of about 3 μm to about 7 μm from the closest edge of the through-substrate-via, and the closest point of the second ring oscillator is in the range of about 10 μm to about 100 μm from the closest edge of the through-substrate-via.
8. The ring oscillator system of claim 1 , wherein the logic difference circuit is a phase comparator that is configured to provide an output signal having a frequency that is based on the difference between the signal frequency of the first ring oscillator and the signal frequency of the second ring oscillator.
9. The ring oscillator system of claim 8 , wherein the logic difference circuit is a phase comparator that comprises a third ring oscillator that is configured to provide a references signal at a predetermined frequency.
10. The ring oscillator system of claim 1 , wherein the signal frequency of the first ring oscillator is different from the signal frequency of the second ring oscillator, and the logic difference circuit is configured to provide an output signal that is commensurate with strains imparted to the substrate by the through-substrate-via, wherein a value of the output signal is based on the difference in the signal frequencies.
11. A method of measuring strain using ring oscillators, comprising:
fabricating a first ring oscillator a first predetermined distance from a through-substrate-via;
fabricating a second ring oscillator a second predetermined distance from the same through-substrate-via, wherein the second predetermined distance is greater than the first predetermined distance; and
detecting a difference between the signal frequency of the first ring oscillator and the signal frequency of the second ring oscillator.
12. The method of claim 11 , wherein fabricating the first ring oscillator involves fabricating an odd number of inverters connected in series, and fabricating the second ring oscillator involves fabricating the same odd number of inverters connected in series as fabricated for the first ring oscillator.
13. The method of claim 11 , wherein the first ring oscillator and the second ring oscillator are fabricated as concentric circles around the same through-substrate-via, where the first ring oscillator is closer to the edge of the through-substrate-via than the second ring oscillator.
14. The method of claim 13 , wherein the first ring oscillator is in the range of about 10 μm and about 30 μm from the edge of the through-substrate-via, and the second ring oscillator is in the range of about 50 μm to about 100 μm from the edge of the through-substrate-via.
15. The method of claim 11 , wherein the first ring oscillator and the second ring oscillator are fabricated in parallel lines, and the first ring oscillator is closer to the edge of the through-substrate-via than the second ring oscillator.
16. The method of claim 15 , wherein the first ring oscillator and the second ring oscillator include one or more long channel, p-doped channel MOSFETs.
17. The method of claim 16 , wherein the closest point of the first ring oscillator is in the range of about 3 μm to about 7 μm from the closest edge of the through-substrate-via, and the closest point of the second ring oscillator is in the range of about 10 μm to about 100 μm from the closest edge of the through-substrate-via.
18. The method of claim 11 , which further comprises providing an output signal having a frequency that is based on the difference between the signal frequency of the first ring oscillator and the signal frequency of the second ring oscillator.
19. The method of claim 18 , wherein comprises a third ring oscillator that is configured to provide a references signal at a predetermined frequency.
20. A method of measuring strain using ring oscillators, comprising:
fabricating a first ring oscillator a first predetermined distance from a through-substrate-via on a substrate;
fabricating a second ring oscillator a second predetermined distance from the same through-substrate-via, wherein the second predetermined distance is greater than the first predetermined distance;
fabricating a logic difference circuit on the substrate; and
detecting a difference between the signal frequency of the first ring oscillator and the signal frequency of the second ring oscillator, wherein the signal frequency of the first ring oscillator is different from the signal frequency of the second ring oscillator, and the logic difference circuit is configured to provide an output signal that is commensurate with strains imparted to the substrate by the through-substrate-via, wherein a value of the output signal is based on the difference in the signal frequencies.