Semiconductor device positioning system and method for semiconductor device positioning
A positioning system and method for positioning a semiconductor device are disclosed. In an embodiment, a positioning system for positioning a semiconductor device includes a long-stroke stage configured to be movable with respect to a supporting structure within a plane and a short-stroke stage attached to the long-stroke stage and configured to carry a semiconductor device and to be rotatable within the plane. The long-stroke stage acts as a balance mass between the short-stroke stage and the supporting structure.
1. A positioning system for positioning a semiconductor device, the positioning system comprising:
a long-stroke stage configured to be linearly movable with respect to a supporting structure within a plane, wherein the long-stroke stage has a first range of motion relative to the supporting structure,
a short-stroke stage attached to the long-stroke stage and configured to carry a semiconductor device and to be linearly movable within the plane, wherein the short-stroke stage is supported by the long-stroke stage and has a second range of motion relative to the long-stroke stage that is smaller than the first range of motion,
wherein the short-stroke stage relative to the supporting structure has a position that is the sum of the position of the short-stroke stage relative to the position of a long-stroke stage and the position of the long-stoke stage relative to the supporting structure, and
a plurality of sensors configured to measure relative positions between the long-stroke stage, the short-stroke stage, and the supporting structure so that the long-stroke stage acts as a balance mass between the short-stroke stage and the supporting structure.
2. The positioning system of claim 1 , wherein the short-stroke stage is further configured to be rotatable within the plane.
3. The positioning system of claim 1 , wherein the long-stroke stage is further configured to be movable in a first direction and a second direction.
4. The positioning system of claim 3 , wherein the long-stroke stage comprises a first long-stroke body configured to be linearly movable in the first direction and a second long-stroke body configured to be linearly movable in the second direction.
5. The positioning system of claim 4 , further comprising:
a first set of linear guides attached to the supporting structure and the first long-stroke body; and
a second set of linear guides attached to the first and second long-stroke bodies.
6. The positioning system of claim 5 , further comprising:
a first long-stroke driver device configured to drive the first long-stroke body on the first set of linear guides along the first direction; and
a second long-stroke driver device configured to drive the second long-stroke body on the second set of linear guides along the second direction.
7. The positioning system of claim 4 , wherein the plurality of sensor devices are configured to measure positions of the first and second long-stroke bodies during a movement of the long-stroke stage.
8. The positioning system of claim 4 , wherein the short-stroke stage comprises a short-stroke body attached to the second long-stroke body through a set of linear guides.
9. The positioning system of claim 8 , further comprising a plurality of short-stroke driver devices configured to linearly move the short-stroke stage.
10. The positioning system of claim 9 , wherein the short-stroke driver devices are further configured to rotate the short-stroke stage clockwise or counter-clockwise.
11. A positioning system for positioning a wafer, the positioning system comprising:
a long-stroke stage configured to be linearly movable in a first direction and a second direction with a first range of motion relative to a supporting structure, wherein the first direction is perpendicular to the second direction; and
a short-stroke stage attached to the long-stroke stage and configured to carry a wafer and to be linearly movable with a second range of motion relative to the long-stroke stage, wherein the second range of motion is smaller than the first range of motion,
wherein the relative position of the short-stroke stage relative to the supporting structure is the sum of the position of the short-stroke stage relative to the position of long-stroke stage and the position of the long-stoke stage relative to the supporting structure; and
a plurality of sensors configured to measure relative positions between the long-stroke stage, the short-stroke stage, and the supporting structure so that the long-stroke stage acts as a balance mass between the short-stroke stage and the supporting structure.
12. The positioning system of claim 11 , wherein the long-stroke stage comprises a first long-stroke body configured to be movable in the first direction and a second long-stroke body configured to be movable in the second direction.
13. The positioning system of claim 12 , further comprising:
a first set of linear guides attached to the supporting structure and the first long-stroke body;
a second set of linear guides attached to the first and second long-stroke bodies;
a first long-stroke driver device configured to drive the first long-stroke body on the first set of linear guides along the first direction; and
a second long-stroke driver device configured to drive the second long-stroke body on the second set of linear guides along the second direction.
14. The positioning system of claim 13 , wherein the plurality of sensor devices are configured to check positions of the first and second long-stroke bodies during a movement of the long-stroke stage.
15. The positioning system of claim 12 , wherein the short-stroke stage comprises a short-stroke body attached to the second long-stroke body through a set of linear guides.
16. The positioning system of claim 15 , further comprising:
a plurality of short-stroke driver devices configured to linearly move the short-stroke stage.
17. A method for positioning a semiconductor device, the method comprising:
linearly moving a long-stroke stage with a first range of motion respect to a supporting structure within a plane; and
linearly moving a short-stroke stage carrying a semiconductor device within a second range of motion within the plane so that a position of the short-stroke stage relative to the supporting structure is the sum of the position of the short-stroke stage relative to a position of long-stroke stage and the position of the long-stoke stage relative to the supporting structure, wherein the short-stroke stage is supported by the long-stroke stage,
wherein the long-stroke stage acts as a balance mass between the short-stroke stage and the supporting structure, and
wherein the semiconductor device includes a plurality of sensors configured to measure relative positions between the long-stroke stage, the short-stroke stage, and the supporting structure so that the long-stroke stage acts as the balance mass between the short-stroke stage and the supporting structure.
18. The method of claim 17 , wherein the second range of motion is smaller than the first range of motion.
19. The method of claim 18 , further comprising rotating the short-stroke stage within the plane, wherein linearly moving the long-stroke stage comprises moving the long-stroke stage in a first direction and a second direction.