Debonding temporarily bonded semiconductor wafers
Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.
1. A method for debonding a device wafer from a carrier wafer, a first side of the carrier wafer temporarily bonded to the device wafer by an adhesive layer, the method comprising:
initiating a crack near an edge of the adhesive layer by applying a perturbation using a crack initiator; and
applying a controlled force perpendicular to the first side of the carrier wafer, the controlled force flexing the first side of the carrier wafer away from the device wafer to control propagation of the crack, wherein the carrier wafer remains planar during the debonding of the device wafer.
2. The method of claim 1 , wherein the controlled force is applied to a perimeter edge of the first side of the carrier wafer.
3. The method of claim 1 , wherein the device wafer has a thickness of less than 50 microns.
4. The method of claim 1 , wherein the device wafer has a thickness of less than 10 microns.
5. The method of claim 1 , wherein a wafer stack comprising the device wafer, the carrier wafer, and the adhesive layer has a total thickness variation of less than 1 micron.
6. The method of claim 1 , wherein flexing the carrier wafer away from the device wafer propagates the crack with a substantially straight leading edge.
7. A method for debonding a device wafer from a carrier wafer comprising:
temporarily bonding a first side of a carrier wafer to a device wafer using an adhesive layer, the device wafer having a thickness of less than 10 microns;
initiating a crack near an edge of the adhesive layer by applying a perturbation with a crack initiator; and
applying a controlled force perpendicular to a first side of the carrier wafer, the controlled force flexing the first side of the carrier wafer away from the device wafer to control propagation of the crack, wherein the carrier wafer remains planar during the debonding of the device wafer.
8. The method of claim 7 , wherein the controlled force is applied to a perimeter edge of the first side of the carrier wafer.
9. The method of claim 7 , wherein the device wafer has a thickness of less than 50 microns.
10. The method of claim 7 , wherein the device wafer has a thickness of less than 10 microns.
11. The method of claim 7 , wherein a wafer stack comprising the device wafer, the carrier wafer, and the adhesive layer has a total thickness variation of less than 1 micron.
12. The method of claim 7 , wherein flexing the carrier wafer away from the device wafer propagates the crack with a substantially straight leading edge.
13. A method for debonding a device wafer from a carrier wafer, a first side of the carrier wafer temporarily bonded to the device wafer by an adhesive layer, the method comprising:
initiating a crack near an edge of the adhesive layer by applying a perturbation using a crack initiator; contacting the carrier wafer with a holdback device at (1) a circumferential edge of the carrier wafer and at (2) the first side of the carrier wafer; and
applying, with the holdback device, a controlled force perpendicular to the first side of the carrier wafer, the controlled force flexing the first side of the carrier wafer away from the device wafer to control propagation of the crack, wherein the carrier wafer remains planar during the debonding of the device wafer.
14. The method of claim 13 , wherein the controlled force is applied to a perimeter edge of the first side of the carrier wafer.
15. The method of claim 13 , wherein the device wafer has a thickness of less than 50 microns.
16. The method of claim 13 , wherein the device wafer has a thickness of less than 10 microns.
17. The method of claim 13 , wherein a wafer stack comprising the device wafer, the carrier wafer, and the adhesive layer has a total thickness variation of less than 1 micron.
18. The method of claim 13 , wherein flexing the carrier wafer away from the device wafer propagates the crack with a substantially straight leading edge.