IP Library Granted Patent US 10,153,603
Granted Patent B1
US 10,153,603 · App. 15/189,632 · Granted Dec 11, 2018

Adapter system

Inventors: James L. Pringle, Jr. (Pelham, NH); Daniel Dufresne (Salem, NH); Stephen E. Strickland (Foxboro, MA)
Assignee: EMC IP Holding Company LLC
H01R31/06G06F13/4081H01R12/724
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Quick Facts
Patent No.
US 10,153,603
App. No.
15/189,632
Granted
Dec 11, 2018
Kind
B1
Abstract

An adapter assembly includes an adapter board. A first connector assembly is coupled to the adapter board and is configured to releasably electrically couple the adapter board to a high-availability IT component. A second connector assembly is coupled to the adapter board and is configured to releasably couple the adapter board to an industry standard expansion card. The adapter assembly is configured to be positioned within an enclosure of a hot swappable IT carrier assembly.

Claims (27)

1. An adapter assembly comprising:

an adapter board including hardware mounted to a surface of the adapter board;

a first connector assembly coupled to the adapter board and configured to releasably electrically couple the adapter board to an IT component; and

a second connector assembly coupled to the adapter board and configured to releasably couple the adapter board to an expansion card, wherein the second connector assembly is configured to position the expansion card above the hardware mounted on the surface of the adapter board and substantially parallel to the surface of the adapter board;

wherein the adapter assembly is configured to be positioned within an enclosure of an IT carrier assembly and wherein the IT carrier assembly is configured to be removably insertable into the IT component; and

wherein the adapter assembly includes hot swap logic configured to enable the IT component to selectively power up and power down the expansion card releasably coupled to the adapter board.

2. The adapter assembly of claim 1 wherein the IT component is a portion of a data array.

3. The adapter assembly of claim 1 wherein the expansion card is a host bus adapter card.

4. The adapter assembly of claim 1 wherein the expansion card is a hot-swappable expansion card.

5. An adapter assembly comprising:

an adapter board including hardware mounted to a surface of the adapter board;

a first connector assembly coupled to the adapter board and configured to releasably electrically couple the adapter board to an IT component, wherein the high-availability IT component is a portion of a data array; and

a second connector assembly configured to releasably couple the adapter board to an expansion card, wherein the second connector assembly is configured to position the expansion card above the hardware mounted on the surface of the adapter board and substantially parallel to the surface of the adapter board;

wherein the adapter assembly is configured to be positioned within an enclosure of a hot swappable IT carrier assembly, wherein the hot swappable IT carrier assembly is configured to be removably insertable into the IT component; and

wherein the adapter assembly includes hot swap logic configured to enable the IT component to selectively power up and power down the expansion card releasably coupled to the adapter board.

6. The adapter assembly of claim 5 wherein the expansion card is a host bus adapter card.

7. The adapter assembly of claim 5 wherein the expansion card is a hot-swappable expansion card.

8. A hot swappable IT carrier assembly comprising:

an enclosure; and

an adapter assembly configured to be positioned within the enclosure, the adapter assembly including:

an adapter board including hardware mounted to a surface of the adapter board;

a first connector assembly coupled to the adapter board and configured to releasably electrically couple the adapter board to a IT component; and

a second connector assembly coupled to the adapter board and configured to releasably couple the adapter board to an expansion card, wherein the second connector assembly is configured to position the expansion card above the hardware mounted on the surface of the adapter board and substantially parallel to the surface of the adapter board;

wherein the hot swappable IT carrier assembly is configured to be removably insertable into the IT component; and

wherein the adapter assembly includes hot swap logic configured to enable the IT component to selectively power up and power down the expansion card releasably coupled to the adapter board.

9. The hot swappable IT carrier assembly of claim 8 wherein the expansion card is a host bus adapter card.

10. The hot swappable IT carrier assembly of claim 8 wherein the expansion card is a hot-swappable expansion card.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2017
From: EMC CORPORATION
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 041872/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2016
From: PRINGLE, JAMES L., JR.; DUFRESNE, DANIEL; STRICKLAND, STEPHEN E.
To: EMC CORPORATION
Reel/Frame 039037/0571 →