IP Library Granted Patent US 10,235,322
Granted Patent B1
US 10,235,322 · App. 15/189,702 · Granted Mar 19, 2019

Hot-swappable adapter system for non-hot-swappable expansion cards

Inventors: James L. Pringle, Jr. (Pelham, NH); Daniel Dufresne (Salem, NH); Stephen E. Strickland (Foxboro, MA)
Assignee: EMC IP Holding Company LLC
G06F13/4068G06F9/442G06F9/4403
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Quick Facts
Patent No.
US 10,235,322
App. No.
15/189,702
Granted
Mar 19, 2019
Kind
B1
Abstract

An adapter assembly includes an adapter board. A first connector assembly is coupled to the adapter board and is configured to releasably electrically couple the adapter board to a high-availability IT component. A second connector assembly is coupled to the adapter board and is configured to releasably couple the adapter board to a non-hot-swappable industry standard expansion card. The adapter board includes hot swap logic configured to enable the non-hot-swappable industry standard expansion card to function as a hot-swappable industry standard expansion card.

Claims (20)

1. An adapter assembly comprising:

an adapter board;

a first connector assembly coupled to the adapter board and configured to releasably electrically couple the adapter board to a high-availability Information Technology (IT) component; and

a second connector assembly coupled to the adapter board and configured to releasably couple the adapter board to a non-hot-swappable expansion card;

wherein the adapter board includes hot swap logic configured to enable the non-hot-swappable expansion card to function as a hot-swappable industry standard expansion card, the hot swap logic including:

start-stop technology that allows the high-availability IT component to power up and power down the non-hot-swappable expansion card, and

softstart technology that limits the amount of current that the non-hot-swappable expansion card can draw upon being powered up so that the current draw of the non-hot-swappable expansion card is not enough to interfere with the operation of other components of the high-availability IT component.

2. The adapter assembly of claim 1 wherein the high-availability IT component is a portion of a data array.

3. The adapter assembly of claim 1 wherein the non-hot-swappable expansion card is a host bus adapter card.

4. The adapter assembly of claim 1 wherein the adapter assembly is configured to be positioned within an enclosure of a hot swappable IT carrier assembly.

5. A hot swappable Information Technology (IT) carrier assembly comprising:

an enclosure; and

an adapter assembly configured to be positioned within an enclosure, the adapter assembly including:

an adapter board;

a first connector assembly coupled to the adapter board and configured to releasably electrically couple the adapter board to a high-availability IT component; and

a second connector assembly coupled to the adapter board and configured to releasably couple the adapter board to a non-hot-swappable expansion card;

wherein the adapter board includes hot swap logic configured to enable the non-hot-swappable expansion card to function as a hot-swappable expansion card, wherein the hot-swap logic includes:

start-stop technology that allows the high-availability IT component to power up and power down the non-hot-swappable expansion card,

softstart technology that limits the amount of current that the non-hot-swappable expansion card can draw upon being powered up so that the current draw of the non-hot-swappable expansion card is not enough to interfere with the operation of other components of the high-availability IT component.

6. The hot swappable IT carrier assembly of claim 5 wherein the non-hot-swappable expansion card is a host bus adapter card.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (050724/0466) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 060753/0486 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST AT REEL 050405 FRAME 0534 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058001/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 15, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 050724/0466 →
SECURITY AGREEMENT Recorded Sep 17, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 050405/0534 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2017
From: EMC CORPORATION
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 041872/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2016
From: PRINGLE, JAMES L., JR.; DUFRESNE, DANIEL; STRICKLAND, STEPHEN E.
To: EMC CORPORATION
Reel/Frame 039497/0848 →