Shear-resistant joint between a superabrasive body and a substrate
Embodiments disclosed herein relate to superabrasive compacts having a metallic member disposed between a superabrasive body and a substrate; and drill bits and methods of making the same.
1. A method of making a superabrasive compact, the method comprising:
providing an assembly including:
a superabrasive body including a plurality of bonded superabrasive grains, an upper surface, a bonding surface having a surface feature, and a lateral surface extending between the upper surface and the bonding surface;
a substrate including a base surface, an interfacial surface having a substrate surface feature, and a substrate lateral surface extending therebetween; and
a metallic member disposed between the bonding surface and the interfacial surface; and
forcing the superabrasive body and substrate toward one another at a temperature below a melting point of the metallic member effective to cause the metallic member to deform into the surface feature of the bonding surface and the substrate surface feature of the interfacial surface.
2. The method of claim 1 , wherein forcing the superabrasive body and substrate toward one another at a temperature below a melting point of the metallic member effective to cause the metallic member to deform into the surface feature of the bonding surface and the substrate surface feature of the interfacial surface includes subjecting the assembly to a temperature of about 800° C. or less.
3. The method of claim 1 , wherein forcing the superabrasive body and substrate toward one another at a temperature below a melting point of the metallic member effective to cause the metallic member to deform into the surface feature of the bonding surface and the substrate surface feature of the interfacial surface includes bonding the superabrasive body to the substrate via the metallic member without wetting the superabrasive body or the substrate with the metallic member.
4. The method of claim 1 , wherein the superabrasive body includes at least partially leached polycrystalline diamond.
5. The method of claim 1 , wherein the metallic member includes at least one of a ductile metal or a braze material.
6. The method of claim 1 , wherein the metallic member includes at least one of copper, nickel, silver, gold, iron, platinum, aluminum, lead, tin, or zinc.
7. The method of claim 1 , wherein at least one of the surface feature or the substrate surface feature includes a recessed pattern.
8. The method of claim 1 , wherein at least one of the surface feature or the substrate surface feature includes recesses having an average recess depth of at least about 125 μm.
9. The method of claim 1 , wherein providing the assembly includes:
positioning the metallic member adjacent to the interfacial surface; and
positioning the bonding surface adjacent to the metallic member.
10. The method of claim 1 , wherein providing the assembly includes forming one or more of the surface feature in the superabrasive body or the substrate surface feature in the substrate by one or more of molding, lasing, milling, grinding, lapping, or electro-discharge machining.
11. A method of making a superabrasive compact, the method comprising:
providing an assembly including:
a polycrystalline diamond body including a plurality of bonded diamond grains, an upper surface, a bonding surface having a surface feature, and a lateral surface extending between the upper surface and the bonding surface;
a substrate including a base surface, an interfacial surface having a substrate surface feature, and a substrate lateral surface extending therebetween; and
a metallic member disposed between the bonding surface and the interfacial surface; and
forcing the polycrystalline diamond body and substrate toward one another at a temperature of about 800° C. or less effective to cause the metallic member to deform into the surface feature of the bonding surface and the substrate surface feature of the interfacial surface.
12. The method of claim 11 , wherein forcing the polycrystalline diamond body and substrate toward one another at a temperature of about 800° C. or less effective to cause the metallic member to deform into the surface feature of the bonding surface and the substrate surface feature of the interfacial surface includes bonding the polycrystalline diamond body to the substrate via the metallic member without wetting the polycrystalline diamond body or the substrate with the metallic member.
13. The method of claim 11 , wherein the polycrystalline diamond body is at least partially leached.
14. The method of claim 11 , wherein the metallic member includes at least one of a ductile metal or a braze material.
15. The method of claim 11 , wherein the metallic member includes at least one of copper, nickel, silver, gold, iron, platinum, aluminum, lead, tin, or zinc.
16. The method of claim 11 , wherein at least one of the surface feature or the substrate surface feature includes a recessed square wave pattern.
17. The method of claim 11 , wherein at least one of the surface feature or the substrate surface feature includes recesses having an average recess depth of at least about 125 μm.
18. The method of claim 11 , wherein providing the assembly includes forming one or more of the surface feature in the superabrasive body or the substrate surface feature in the substrate by one or more of molding, lasing, milling, grinding, lapping, or electro-discharge machining.
19. A method of making a superabrasive compact, the method comprising:
providing an assembly including:
a polycrystalline diamond body including a plurality of bonded diamond grains, an upper surface, a bonding surface having a surface feature, and a lateral surface extending between the upper surface and the bonding surface, wherein the surface feature includes a square wave recessed pattern, and the polycrystalline diamond body is at least partially leached;
a substrate including a base surface, an interfacial surface having a substrate surface feature, and a substrate lateral surface extending therebetween, wherein the substrate surface feature includes a square wave recessed pattern; and
a metallic member disposed between the bonding surface and the interfacial surface, wherein the metallic member includes at least one of copper, nickel, silver, gold, iron, platinum, aluminum, lead, tin, or zinc; and
bonding the polycrystalline diamond body to the substrate via the metallic member without wetting the polycrystalline diamond body or the substrate with the metallic member.
20. The method of claim 19 , wherein bonding the polycrystalline diamond body to the substrate via the metallic member without wetting the polycrystalline diamond body or the substrate with the metallic member includes subjecting the assembly to an elevated temperature of about 800° C. or less.