System for improving solar cell manufacturing yield
A method is described for protecting photovoltaic cells. During the fabrication process, a photovoltaic cell can be received from a first processing station. The photovoltaic cell can have at least one exposed surface, which may include crystalline silicon or oxidized crystalline silicon. The photovoltaic cell can then be placed in a controlled microenvironment with controlled chemical content, which can protect the exposed surface of the photovoltaic cell from contamination. Subsequently, the photovoltaic cell can be moved toward and delivered to a second processing station in the controlled microenvironment.
1. A system for protecting photovoltaic structures between fabrication processes, the system comprising:
a microenvironment communicatively couples a wet processing station and a dry processing station such that a substrate remains within the controlled microenvironment while being transferred from the wet processing station to the dry processing station, wherein the microenvironment is separate from a fabrication environment housing the wet processing station and the dry processing station, wherein the microenvironment is filled with a gas that does not react with an exposed surface of the substrate, and wherein the exposed surface of the substrate comprises crystalline silicon or oxidized crystalline silicon; and
a microenvironment controller for controlling the microenvironment.
2. The system of claim 1 , wherein the microenvironment controller is configured to control density of at least one chemical that can contaminate or react with the exposed surface of the substrate.
3. The system of claim 2 , wherein controlling the density of the at least one chemical comprises removing 70% or more at least one chemical selected from a group consisting of: NO x , NH 3 , SO x , H 2 S, and volatile organic compound.
4. The system of claim 1 , wherein the microenvironment controller is configured to maintain a relative humidity in the microenvironment below 20%.
5. The system of claim 1 , wherein the microenvironment controller is configured to maintain, within the microenvironment, the gas at a purity of at least 99.9% and a pressure of between 700 and 800 Torr.
6. The system of claim 1 , further comprising a microenvironment monitoring module configured to monitor at least one environmental characteristic selected from a group consisting of: a humidity parameter, a chemical density parameter, and a particulate density parameter.
7. The system of claim 1 , further comprising a performance-testing module configured to test performance of a photovoltaic structure fabricated on the substrate after the substrate is processed in the dry processing station.
8. The system of claim 1 , wherein the microenvironment includes a room.
9. The system of claim 1 , wherein the microenvironment includes a tunnel.
10. The system of claim 1 , wherein the microenvironment includes a container.
11. A system for fabricating photovoltaic structures, the system comprising:
a wet processing station positioned within a fabrication environment, wherein the wet processing station is configured to form an oxide layer on a surface of a substrate;
a dry processing station positioned within the fabrication environment; and
a controlled microenvironment communicatively couples the wet processing station and the dry processing station such that the substrate remains within the controlled microenvironment while being transferred from the wet processing station to the dry processing station, wherein the controlled microenvironment is separate from the fabrication environment, and wherein the controlled microenvironment is filled with a gas that does not react with the oxide layer.
12. The system of claim 11 , wherein the dry processing station comprises a physical vapor deposition tool, a chemical vapor deposition tool, or a combination thereof.
13. The system of claim 11 , further comprising a microenvironment controller configured to control density of at least one chemical in the microenvironment that can contaminate or react with the oxide layer of the substrate.
14. The system of claim 13 , wherein controlling the density of the at least one chemical comprises removing 70% or more at least one chemical selected from a group consisting of: NO x , NH 3 , SO x , H 2 S, and volatile organic compound.
15. The system of claim 13 , wherein the microenvironment controller is further configured to maintain a relative humidity in the microenvironment below 20%.
16. The system of claim 13 , wherein the microenvironment controller is further configured to maintain, within the controlled microenvironment, the gas at a purity of at least 99.9% and a pressure between 700 and 800 Torr.
17. The system of claim 11 , further comprising a microenvironment monitoring module configured to monitor at least one microenvironment characteristic selected from a group consisting of: a humidity parameter, a chemical density parameter, and a particulate density parameter.
18. The system of claim 11 , wherein the controlled microenvironment includes a room.
19. The system of claim 11 , wherein the controlled microenvironment includes a tunnel.
20. The system of claim 11 , wherein the controlled microenvironment includes a container.