LED filament and LED bulb with LED filament
View Patent ↗The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.
1. A LED filament, comprising: a carrier, LED chips disposed on the carrier, wherein the carrier comprises a first lateral section and a second lateral section opposite to the first lateral section, the first lateral section is located at a side of the carrier in a thicknesswise direction of the carrier, and the second lateral section is located at an opposite side of the carrier in the thicknesswise direction of the carrier, the LED chips are formed on the first lateral section and covered by the first lateral section as well as the second lateral section in the thicknesswise direction of the carrier, hardness of the first lateral section is less than that of the second lateral section, heat dissipation performance of the first lateral section is better than that of the second lateral section.
2. The LED filament according to claim 1 , wherein the carrier comprises a substrate, a first adhesive and a second adhesive, the substrate contains a first surface and a second surface opposite to the first surface, the LED chips are disposed on the first surface of the substrate, the first lateral section is formed by the first adhesive covering the first surface and the LED chips, the second lateral section is formed by the second adhesive covering the second surface.
3. The LED filament according to claim 2 , wherein Shore hardness type A of the first adhesive is less than or equal to 55, Shore hardness type A of the second adhesive is more than or equal to 70, and a difference of the Shore hardness type A of the first adhesive and the Shore hardness type A of the second adhesive is more than or equal to 15.
4. The LED filament according to claim 2 , wherein a material of the first adhesive and the second adhesive is epoxy resin, silica gel, methyl silicone resin, phenyl silicone resin, methyl phenyl silicone resin or modified silicone resin, fluorescent powders are dispersed in the first adhesive and the second adhesive.
5. The LED filament according to claim 2 , wherein the substrate is formed by a metal material, transparent ceramic, sapphire or glass, through-holes are defined on the substrate.
6. The LED filament according to claim 1 , wherein the substrate comprises a substrate, a first adhesive and a second adhesive, the substrate comprises a first bracket and a second bracket connected with the first bracket, the first bracket has an upper surface away from the second bracket, the second bracket has a bottom surface away from the first bracket, the LED chips are disposed on the upper surface of the first bracket, the first adhesive covers the upper surface of the first bracket and the LED chips, the first adhesive and the first bracket form the first lateral section, the second adhesive covers the bottom surface of the second bracket, the second adhesive and the second bracket form the second lateral section.
7. The LED filament according to claim 6 , wherein a thermal conductivity of the first bracket is higher than that of the second bracket, brittleness of the first bracket is more than that of the second bracket, and a thickness of the first bracket is less than that of the second bracket.
8. The LED filament according to claim 7 , wherein the first bracket and the second bracket are formed by metal materials, and hardness of the metal material of the first bracket is less than that of the second bracket.
9. The LED filament according to claim 7 , wherein the first bracket is formed by transparent ceramic or sapphire, the second bracket is formed by glass.
10. The LED filament according to claim 7 , wherein the first bracket and the second bracket are connected by pasting with an adhesive, sintering, sputtering, evaporate plating or electroplating.
11. A LED bulb, comprising: a lamp holder, a transparent lampshade, a stem and a LED filament, the transparent lampshade and the stem connected with the lamp holder firmly, the LED filament comprising: a carrier, LED chips disposed on the carrier, wherein the carrier comprises a first lateral section and a second lateral section opposite to the first lateral section, the first lateral section is located at a side of the carrier in a thicknesswise direction of the carrier, and the second lateral section is located at an opposite side of the carrier in the thicknesswise direction of the carrier, the LED chips are formed on the first lateral section and covered by the first lateral section as well as the second lateral section in the thicknesswise direction of the carrier, hardness of the first lateral section is less than that of the second lateral section, heat dissipation performance of the first lateral section is better than that of the second lateral section.
12. The LED bulb according to claim 11 , wherein the carrier comprises a substrate, a first adhesive and a second adhesive, the substrate contains a first surface and a second surface opposite to the first surface, the LED chips are disposed on the first surface of the substrate, the first lateral section is formed by the first adhesive covering the first surface and the LED chips, the second lateral section is formed by the second adhesive covering the second surface.
13. The LED bulb according to claim 12 , wherein Shore hardness type A of the first adhesive is less than or equal to 55, Shore hardness type A of the second adhesive is more than or equal to 70, and a difference of the Shore hardness type A of the first adhesive and the Shore hardness type A of the second adhesive is more than or equal to 15.
14. The LED bulb according to claim 12 , wherein a material of the first adhesive and the second adhesive is epoxy resin, silica gel, methyl silicone resin, phenyl silicone resin, methyl phenyl silicone resin or modified silicone resin, fluorescent powders are dispersed in the first adhesive and the second adhesive.
15. The LED bulb according to claim 12 , wherein the substrate is formed by metal materials, transparent ceramic, sapphire or glass, through-holes are defined on the substrate.
16. The LED bulb according to claim 11 , wherein the substrate comprises a substrate, a first adhesive and a second adhesive, the substrate comprises a first bracket and a second bracket connected with the first bracket, the first bracket has an upper surface away from the second bracket, the second bracket has a bottom surface away from the first bracket, the LED chips are disposed on the upper surface of the first bracket, the first adhesive covers the upper surface of the first bracket and the LED chips, the first adhesive and the first bracket form the first lateral section, the second adhesive covers the bottom surface of the second bracket, the second adhesive and the second bracket form the second lateral section.
17. The LED bulb according to claim 16 , wherein a thermal conductivity of the first bracket is higher than that of the second bracket, brittleness of the first bracket is more than that of the second bracket, and a thickness of the first bracket is less than that of the second bracket.
18. The LED bulb according to claim 17 , wherein the first bracket and the second bracket are formed by metal materials, and hardness of the metal material of the first bracket is less than that of the second bracket.
19. The LED bulb according to claim 17 , wherein the first bracket is formed by transparent ceramic or sapphire, the second bracket is formed by glass.
20. The LED bulb according to claim 17 , wherein the first bracket and the second bracket are connected by pasting with an adhesive, sintering, sputtering, evaporate plating or electroplating.