PRINTED CIRCUIT BOARD WITH ENHANCED IMMUNITY TO SIMULTANEOUS SWITCHING NOISE
A printed circuit board including a series-wound inductor and two capacitors to reduce the susceptibility of a printed circuit board to simultaneous switching noise includes a ground layer; a power layer defining a slot loop to isolate a metal plate within, and a via hole coupled between the metal plate and the ground layer. An electronic device with the printed circuit board is also disclosed.
1 . A printed circuit board comprising:
a grounded layer;
a power layer defining a slot loop to separate an isolated metal plate from the power layer within the slot loop; and
a via hole coupled between the metal plate and the grounded layer.
2 . The printed circuit board of claim 1 , further comprising a signal line, wherein the power layer defines a first through hole, the grounded layer defines a second through hole, and the signal line passes through the power layer and the grounded layer via the first through hole and the second through hole.
3 . The printed circuit board of claim 2 , wherein the first through hole is aligned with the second through hole.
4 . The printed circuit board of claim 1 , wherein the slot loop is substantially rectangular.
5 . The printed circuit board of claim 1 , wherein the metal plate is rectangular.
6 . The printed circuit board of claim 1 , wherein a metal plate top surface is coplanar with a power layer top surface.
7 . The printed circuit board of claim 6 , wherein a metal plate bottom surface is coplanar with a power layer bottom surface.
8 . A printed circuit board comprising:
a grounded layer;
a power layer defining a slot loop to separate an isolated metal plate from the power layer within the slot loop;
a via hole coupled between the metal plate and the grounded layer; and
a signal line passing through the grounded layer and the power layer.
9 . The printed circuit board of claim 8 , wherein the power layer defines a first through hole, the grounded layer defines a second through hole, and the signal line passes through the power layer and the grounded layer via the first through hole and the second through hole.
10 . The printed circuit board of claim 9 , wherein the first through hole is aligned with the second through hole.
11 . The printed circuit board of claim 8 , wherein the slot loop is substantially rectangular.
12 . The printed circuit board of claim 8 , wherein the metal plate is rectangular.
13 . The printed circuit board of claim 8 , wherein a metal plate top surface is coplanar with a power layer top surface.
14 . The printed circuit board of claim 13 , wherein a metal plate bottom surface is coplanar with a power layer bottom surface.
15 . An electronic device comprising:
a housing; and
a printed circuit board received in the housing and comprising:
a grounded layer;
a power layer defining a slot loop to separate an isolated metal plate from the power layer within the slot loop; and
a via hole coupled between the metal plate and the grounded layer.
16 . The electronic device of claim 15 , further comprising a signal line, wherein the power layer defines a first through hole, the grounded layer defines a second through hole, and the signal line passes through the power layer and the grounded layer via the first through hole and the second through hole.
17 . The electronic device of claim 16 , wherein the first through hole is aligned with the second through hole.
18 . The electronic device of claim 15 , wherein the slot loop is substantially rectangular, and the metal plate is rectangular.
19 . The electronic device of claim 15 , wherein a metal plate top surface is coplanar with a power layer top surface.
20 . The electronic device of claim 19 , wherein a metal plate bottom surface is coplanar with a power layer bottom surface.