Insulated wire, coil, and electronic/electrical equipment
View Patent ↗An insulated wire, having a thermosetting resin covering (A), directly or by interposing an insulating layer (C), on a conductor having a rectangular cross-section, and a thermoplastic resin covering (B) on a periphery of the thermosetting resin covering (A), wherein the thermoplastic resin covering (B) has at least two layers of the thermoplastic resin layers, and the thermoplastic resin layers adjacent to each other are formed of thermoplastic resins different from each other, at least one layer of the thermoplastic resin layers is formed of polyether ether ketone or modified polyether ether ketone, and a total thickness of the thermoplastic resin layers is 60 to 120 μm, and a thickness of a thinnest thermoplastic resin layer is 5 to 20 μm; and a coil formed by winding processing the insulated wire and an electrical equipment having the coil.
1. An insulated wire, comprising a thermosetting resin covering (A), directly or by interposing an insulating layer (C), on a conductor having a rectangular cross-section, and a thermoplastic resin covering (B), as an extrusion covering, on a periphery of the thermosetting resin covering (A), wherein
the thermoplastic resin covering (B) has at least two layers of the thermoplastic resin layers, and
the thermoplastic resin layers adjacent to each other are formed of thermoplastic resins different from each other, at least one layer of the thermoplastic resin layers is formed of polyether ether ketone or modified polyether ether ketone, and a total thickness of the thermoplastic resin layers is 65 to 120 μM, and a thickness of a thinnest thermoplastic resin layer among the thermoplastic resin layers is 5 to 20 μm.
2. The insulated wire according to claim 1 , wherein an outermost layer of the thermoplastic resin covering (B) is a thermoplastic layer formed of the polyether ether ketone or the modified polyether ether ketone.
3. The insulated wire according to claim 1 , wherein the thermoplastic resin covering (B) is formed of two layers of the thermoplastic resin layers.
4. The insulated wire according to claim 1 , wherein the thinnest thermoplastic resin layer is provided inside the thermoplastic resin layer formed of the polyether ether ketone or the modified polyether ether ketone.
5. A coil formed by winding processing the insulated wire according to claim 1 .
6. Electronic/electrical equipment, having the coil according to claim 5 .
7. The insulated wire according to claim 1 , wherein the insulated wire comprises the insulating layer (C).
8. The insulated wire according to claim 7 , wherein the insulating layer (C) comprises polyurethane.
9. The insulated wire according to claim 1 ,
wherein an outermost layer of the thermoplastic resin covering (B) is a thermoplastic layer formed of the polyether ether ketone or the modified polyether ether ketone, and
wherein the thermoplastic resin covering (B) is formed of two layers of the thermoplastic resin layers.