METHODS OF MAKING MEDICAL DEVICES
A vacuum deposition substrate comprising at least one of a plurality of patterned recesses, raises, or openings. The at least one of a plurality of patterned recesses, raises, or openings further define a geometry of a medical device.
1 . A vacuum deposition substrate comprising at least one of a plurality of patterned recesses, at least one of a plurality of patterned raises, or at least at least one of a plurality of patterned openings.
2 . The vacuum deposition substrate of claim 1 wherein the at least one of the plurality of patterned recesses or the at least one of a plurality of patterned raises is configured to define a geometry of a scaffold.
3 . The vacuum deposition substrate of claim 1 wherein the vacuum deposition substrate is tubular.
4 . The vacuum deposition substrate of claim 1 wherein the at least one of the plurality of patterned recesses or the at least one of a plurality of patterned raises is configured to define a geometry of a stent.
5 . The vacuum deposition substrate of claim 1 wherein vacuum deposition substrate is substantially planar.
6 . The vacuum deposition substrate of claim 1 wherein the vacuum deposition substrate is arcuate.
7 . The vacuum deposition substrate of claim 1 further comprised of a deoxygenated copper material.
8 . The vacuum deposition substrate of claim 7 further comprised of a titanium nitride coating on a surface.
9 . The vacuum deposition substrate of claim 8 wherein the titanium nitride coating is configured as a diffusion barrier to prevent migration of copper into a deposited layer.
10 . The vacuum deposition substrate of claim 1 further configured to be rotated about a longitudinal axis, moved in an X-Y plane, or planatarily or rotationally moved within a deposition chamber to facilitate deposition or patterning of a deposited material onto the vacuum deposition substrate.
11 . The vacuum deposition substrate of claim 2 wherein the patterned openings comprise a plurality of circular openings passing through the vacuum deposition substrate.
12 . The vacuum deposition substrate of claim 11 wherein the plurality of circular openings is patterned in a regular array of rows and columns with regular inter-opening spacing 165 between adjacent openings.
13 . The vacuum deposition substrate of claim 12 wherein a diameter of each of the plurality of circular openings is about 19 μm, with an inter-opening spacing in each row and column of about 34 μm on center.
14 . The vacuum deposition substrate of claim 2 wherein the patterned openings comprise an alternating slot pattern in which the patterned openings are arrayed adjacent one another forming a y-axis oriented array relative to the vacuum deposition substrate, further wherein a second plurality of patterned openings are arrayed adjacent one another forming an x-axis oriented array relative to vacuum deposition substrate.
15 . The vacuum deposition substrate of claim 14 inter-array wherein the alternating slot pattern includes a spacing between the y-axis oriented array and the x-axis oriented array of about 17 μm, further wherein each of the plurality of openings has a length of about 153 μm and a width of about 17 μm.
16 . The vacuum deposition substrate of claim 2 wherein the patterned openings comprise an array of a plurality of diamond-shaped openings passing through the vacuum deposition substrate.
17 . The vacuum deposition substrate of claim 16 wherein the plurality of diamond-shaped openings includes a dimension configured to permit cellular migration through the plurality of diamond-shaped openings while preventing blood flow or seepage, and passage of embolic material through the plurality of diamond-shaped openings.