IP Library Granted Patent US 10,511,082
Granted Patent B2
US 10,511,082 · App. 15/198,782 · Granted Dec 17, 2019

Antenna

Inventors: Jose Rodrigo Camacho Perez (Guadalajara Jalisco, MX); Seong-Youp J. Suh (Portland, OR); Tae-Young Yang (Hillsboro, OR)
Assignee: Intel Corporation
H01Q1/243H01Q1/2275H01Q1/48H01Q1/50H01Q5/40H01Q13/02H01Q21/28
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Quick Facts
Patent No.
US 10,511,082
App. No.
15/198,782
Granted
Dec 17, 2019
Kind
B2
Abstract

An antenna including a substrate; top and bottom grounded conductive layers formed on respective larger faces of the substrate; an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna; and at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers, wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two sides not covered by a conductive layer.

Claims (46)

1. An antenna, comprising:

a substrate;

top and bottom grounded conductive layers formed on respective larger faces of the substrate;

at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers,

wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two edges not covered by a conductive layer; and

an antenna feed coupled to at least one of the top and bottom grounded conductive layers of each of the antenna cavities, and configured to feed radio signals to the respective antenna cavity.

2. The antenna of claim 1 , wherein the substrate has a constant thickness.

3. The antenna of claim 1 , wherein the substrate has an irregular material comprised of any of air, dielectric, magnetic, and a combination thereof.

4. The antenna of claim 1 , wherein the substrate has a regular contour.

5. The antenna of claim 1 , wherein the substrate has an irregular contour.

6. The antenna of claim 1 , wherein the at least one conductive wall is a solid wall.

7. The antenna of claim 1 , wherein the at least one conductive wall comprises vias.

8. The antenna of claim 1 , further comprising:

a tuning component coupled to at least one of the top and bottom grounded conductive layers of at least one of the antenna cavities, and configured to tune the antenna cavity to a specific frequency.

9. The antenna of claim 1 , wherein the antenna is an interchangeable antenna card with an interconnect layer and is insertable in a wireless device.

10. A wireless device, comprising:

the antenna of claim 1 .

11. The wireless device of claim 10 , wherein the antenna forms at least a portion of a back cover of the wireless device.

12. The wireless device of claim 10 , further comprising:

a socket configured to receive the antenna.

13. An antenna, comprising:

a substrate having at least one of an irregular contour and an irregular thickness;

top and bottom grounded conductive layers formed on respective larger faces of the substrate; and

an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna,

wherein the substrate forms an antenna cavity configured to operate at a specific frequency, and comprises at least two sides not covered by a conductive layer.

14. The antenna of claim 13 , wherein the substrate has a constant thickness.

15. The antenna of claim 13 , wherein the substrate has an irregular thickness.

16. The antenna of claim 13 , wherein the substrate has a regular contour.

17. The antenna of claim 13 , wherein the substrate has an irregular contour.

18. The antenna of claim 13 , further comprising:

a tuning component coupled to at least one of the top and bottom grounded conductive layers, and configured to tune the antenna to a specific frequency.

19. The antenna of claim 13 , wherein the antenna is an interchangeable antenna card with an interconnect layer and is insertable in a wireless device.

20. A wireless device, comprising:

the antenna of claim 13 .

21. The wireless device of claim 20 , wherein the antenna forms at least a portion of a back cover of the wireless device.

22. The wireless device of claim 20 , further comprising:

a socket configured to receive the antenna.

23. A method of forming an antenna, the method comprising:

forming a substrate having at least one of an irregular contour and an irregular thickness;

forming top and bottom grounded conductive layers on respective larger faces of the substrate; and

forming an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna,

wherein the substrate forms an antenna cavity configured to operate at a specific frequency, and comprises at least two sides not covered by a conductive layer.

24. The method of claim 23 , further comprising:

forming at least one conductive wall to the top and bottom grounded conductive layers, to form a short-circuit between the top and bottom grounded conductive layers,

wherein the substrate and the at least one conductive wall form a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the antenna cavities comprises at least two sides not covered by a conductive layer.

25. The method of claim 24 , wherein the forming the at least one conductive wall comprises forming vias.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2020
From: INTEL CORPORATION
To: APPLE INC.
Reel/Frame 052916/0308 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2016
From: CAMACHO PEREZ, JOSE RODRIGO; SUH, SEONG-YOUP J.; YANG, TAE-YOUNG
To: INTEL CORPORATION
Reel/Frame 039560/0939 →
Continuity (1)
Related Publication 20180006360A1 · Jan 4, 2018
Cited By (1)
US 12,555,917