Method and system for attachment of a heat sink to a circuit board
A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.
1. A computer system comprising:
a heat sink comprising a peripheral portion and a middle portion;
a circuit board;
a first controller configured to be secured to the circuit board;
one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink; and
a standoff component comprising:
a first threaded section configured to secure the standoff component to the circuit board, and
a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink;
wherein:
the one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller; and
the standoff component further comprises a middle section separating the first threaded section and the second threaded section, wherein the middle section comprises:
a first collar configured to be placed through a spring loaded clip to be secured onto the first controller, and
a second collar configured to allow the heat sink to have substantially planar thermal contact with the first controller.
2. The computer system of claim 1 wherein: the second threaded section is further configured to accept a nut; and the second threaded section and the nut cooperate to secure the standoff component to the heat sink.
3. The computer system of claim 1 wherein the middle section comprises:
the first collar comprising a first thickness; and
the second collar comprising a second thickness.
4. The computer system of claim 3 wherein when the standoff component and the first controller are secured to the circuit board, the second collar is configured to be approximately at a same height from the circuit board as the first controller.
5. The computer system of claim 1 wherein the first controller is further configured to be located between the one or more attachment devices and the standoff component when the heat sink is secured to the circuit board.
6. The computer system of claim 1 further comprising a second controller configured to be secured to the circuit board, wherein the standoff component is further configured to be located between the first controller and the second controller when the heat sink is secured to the circuit board.
7. The computer system of claim 1 wherein the one or more attachment devices comprises one or more push pins.
8. The computer system of claim 1 wherein the first threaded section and the second threaded section comprise separate pieces.
9. A method for securing a heat sink to a circuit board, the method comprising:
securing a first threaded section of a standoff component to a circuit board;
securing a first collar of the standoff to be placed through a spring loaded clip to be secured onto a controller;
securing a second threaded section of the standoff component to a heat sink at a middle portion of the heat sink;
securing a second collar of the standoff to allow the heat sink to have substantially planar thermal contact with the controller; and
securing one or more attachment devices to the circuit board at a peripheral portion of the heat sink; wherein the one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the controller located on the circuit board.
10. The method of claim 9 wherein the first threaded section and the second threaded section are separated by a middle section of the standoff component, and wherein the middle section comprises the first collar comprising a first thickness, and the second collar comprising a second thickness.
11. The method of claim 10 wherein securing the first threaded section of the standoff component to the circuit board comprises securing the first threaded section of the standoff component to the circuit board such that the second collar is approximately at a same height from the circuit board as the controller when the controller is secured to the circuit board.
12. The method of claim 10 wherein the one or more attachment devices comprises one or more push pins.