IP Library › Patent Application 15206653
Patent Application
App. No. 15/206,653

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
15/206,653
Abstract

A sample semiconductor device is manufactured and the curvature of the sample is measured. An area is set to be removed from an encapsulation resin layer on the basis of the measurement value. After forming the encapsulation resin layer during the process of manufacturing the semiconductor device, the removal area is removed.

Claims (6)

1 . A method for manufacturing a semiconductor device, comprising:

manufacturing a sample semiconductor device;

taking a measurement value relating to curvature of the sample;

determining a removal region having a region for removal from a sealing resin layer covering one surface of the semiconductor device positioned on the opposite side of a substrate when the semiconductor device is mounted on said substrate in accordance with the measurement value;

forming the sealing resin layer; and

removing the removal region.

Assignments (1)
CHANGE OF NAME Recorded Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →