Image sensors having curved upper surfaces and image sensor modules including the same

1. An image sensor, comprising:

a circuit board;

a supporting board provided under the circuit board;

an image sensor chip provided over the circuit board;

a board wiring layer and an adhesive layer which are provided between the circuit board and the image sensor chip; and

a chip connector electrically connecting the circuit board to the board wiring layer together,

wherein the circuit board, the supporting board, and the image sensor chip respectively have concavely curved upper surfaces,

wherein the supporting board comprises a central area and a peripheral area, and

wherein the central area is thinner than the peripheral area.

2. The image sensor of claim 1 ,

wherein the circuit board comprises a flexible printed circuit board.

3. The image sensor of claim 1 ,

wherein the supporting board comprises a thermosetting material.

4. The image sensor of claim 1 ,

wherein the supporting board comprises:

a supporting plate having the concavely curved upper surface; and

a plurality of supporting members provided under the supporting plate.

5. The image sensor of claim 4 ,

wherein each of the plurality of supporting members has a bump shape downwardly protruding from a bottom surface of the supporting plate.

6. The image sensor of claim 5 ,

wherein the plurality of supporting members includes first supporting members located in the central area and second supporting members located in the peripheral area, and

wherein the first supporting members are smaller in size than the second supporting members.

7. The image sensor of claim 4 ,

wherein the supporting plate and the plurality of supporting members are formed of the same material.

8. The image sensor of claim 4 ,

wherein the plurality of supporting members are spaced apart from each other, and

wherein the image sensor further comprises a fixing material which is provided under the supporting plate and between the plurality of supporting members.

9. The image sensor of claim 8 ,

wherein the fixing material comprises a thermosetting material.

10. An image sensor, comprising:

a circuit board;

a supporting board provided under the circuit board;

a board wiring layer provided over the circuit board; and

an image sensor chip provided over the board wiring layer,

wherein the supporting board comprises a supporting plate and a plurality of supporting members,

wherein the supporting plate has a concavely curved upper surface,

wherein the plurality of supporting members is provided under the supporting plate, and

wherein the supporting plate and the plurality of supporting members are formed of the same material.

11. The image sensor of claim 10 ,

wherein each of the plurality of supporting members has a pillar shape.

12. The image sensor of claim 11 ,

wherein the plurality of supporting members includes first supporting members and second supporting members,

wherein the first supporting members are located under a central area of the supporting plate,

wherein the second supporting members are located under a peripheral area of the supporting plate, and

wherein the first supporting members are shorter in length than the second supporting members.

13. The image sensor of claim 10 ,

wherein the plurality of supporting members are not disposed under a central area of the supporting plate and are disposed under a peripheral area of the supporting plate.

14. The Image sensor of claim 10 ,

wherein bottom surfaces of the plurality of supporting members are arranged horizontally flat.

15. The image sensor of claim 10 ,

wherein the circuit board, the supporting plate, and the board wiring layer comprise first, second, and third central areas and first, second, and third peripheral areas, respectively,

wherein upper surfaces of the first, the second, and the third central areas are concavely curved, and wherein upper surfaces of the first, the second, and the third peripheral areas are flat.

16. The image sensor of claim 15 ,

wherein the image sensor chip comprises a pixel array and circuit array,

wherein the pixel array is provided over the third center area of the circuit board,

wherein the circuit array is provided over the third peripheral area of the circuit board, and

wherein the first, the second, and the third central areas of the circuit board, the supporting plate of the supporting board, and the board wiring layer vertically overlap the pixel array of the image sensor chip.

17. An image sensor, comprising:

a flexible circuit board;

a rigid supporting board provided under the flexible circuit board;

a board wiring layer provided over the flexible circuit board; and

an image sensor chip provided over the board wiring layer,

wherein the circuit board, the supporting board, the board wiring layer, and the image sensor chip comprise first areas and second areas, respectively,

wherein each of the second areas is located in a periphery of each of the first areas,

wherein each of the first areas has a concavely curved upper surface,

wherein each of the second areas has a flat upper surface, and

wherein the first area of the supporting board has a concave-convex bottom surface.

18. The image sensor of claim 17 ,

wherein the supporting board comprises:

a supporting plate comprising a third area and a fourth area, and

supporting members provided under the third area of the supporting plate,

wherein an upper surface of the supporting plate in the third area forms the concavely curved upper surface of the supporting board, and

wherein the supporting members in the fourth area, in combination, form the concave-convex bottom surface of the supporting board.

19. The image sensor of claim 18 ,

wherein the supporting members are spaced apart from each other, and

wherein the image sensor further comprises a fixing member which is disposed under the third area of the supporting plate and between the supporting members.