Electronic apparatus, manufacturing method thereof, oscillator, electronic appliance, and mobile unit
An electronic apparatus according to the invention includes a substrate, a side wall that is disposed directly on the substrate or via an insulation film and forms a hollow, a functional element that is disposed within the hollow, a first layer that is disposed on the side wall so as to cover the hollow and has a first through hole that communicates with the hollow, a second layer that is disposed on the first layer so as to cover the hollow and has a second through hole that has a diameter smaller than a diameter of the first through hole and at least partially overlaps the first through hole as viewed in plan view, and a third layer that is disposed on the second layer so as to seal at least the second through hole.
1. An electronic apparatus comprising:
a substrate;
a trench formed in the substrate;
a first insulation film disposed on the bottom and sides of the trench and directly on the substrate;
a side wall that is spaced from the portion of the first insulation film on the sides of the trench to form a space between an exterior surface of the side wall and the portion of the first insulation film on the sides of the trench, the side wall being disposed directly on the portion of the first insulation film on the bottom of the trench and also forming a hollow separated from the space by the side wall and bounded by interior surfaces of the side wall;
a second insulation film within the trench and filling the space between the exterior of the side walls and the portion of the first insulation film on the sides of the trench;
a functional element that is disposed within the hollow;
a first layer that is disposed on the side wall so as to cover the hollow and has a first through hole that communicates with the hollow;
a second layer that is disposed on the first layer so as to cover the hollow and has a second through hole that has a diameter smaller than a diameter of the first through hole and at least partially overlaps the first through hole as viewed in plan view; and
a third layer that is disposed on the second layer so as to seal at least the second through hole.
2. The electronic apparatus according to claim 1 ,
wherein the first layer has a rigidity higher than the second layer.
3. The electronic apparatus according to claim 1 ,
wherein the first layer is thicker than the second layer.
4. The electronic apparatus according to claim 1 ,
wherein the second through hole has a diameter of 0.3 μm or less.
5. The electronic apparatus according to claim 1 ,
wherein the side wall and the functional element are disposed within a surface recess of the substrate.
6. The electronic apparatus according to claim 5 ,
wherein the surface recess is disposed in a first region of the substrate, and a MOS transistor is disposed in a second region of the substrate.
7. An oscillator comprising the electronic apparatus according to claim 1 .
8. An electronic appliance comprising the electronic apparatus according to claim 1 .
9. A mobile unit comprising the electronic apparatus according to claim 1 .
10. An oscillator comprising the electronic apparatus according to claim 2 .
11. An oscillator comprising the electronic apparatus according to claim 3 .
12. An oscillator comprising the electronic apparatus according to claim 4 .
13. An oscillator comprising the electronic apparatus according to claim 5 .
14. An oscillator comprising the electronic apparatus according to claim 6 .
15. An electronic appliance comprising the electronic apparatus according to claim 2 .
16. An electronic appliance comprising the electronic apparatus according to claim 3 .
17. An electronic appliance comprising the electronic apparatus according to claim 4 .
18. An electronic appliance comprising the electronic apparatus according to claim 5 .