IP Library Granted Patent US 10,103,311
Granted Patent B2
US 10,103,311 · App. 15/211,569 · Granted Oct 16, 2018

Flexible sink for a thermoelectric energy generation system

Inventor: Joshua E. Moczygemba (Wylie, TX)
Assignee: Marlow Industries, Inc.
H01L35/32H01L35/08H01L35/30H01L35/34
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Quick Facts
Patent No.
US 10,103,311
App. No.
15/211,569
Granted
Oct 16, 2018
Kind
B2
Abstract

A system comprises a plurality of thermoelectric elements, a first plate coupled to the plurality of thermoelectric elements, and a second plate coupled to the plurality of thermoelectric elements. The second plate is arranged to be thermally coupled to an environment. The system further comprises a first plurality of ductile fibers coupled to the second plate. The plurality of ductile fibers are configured to transfer heat between the second plate and the environment.

Claims (32)

1. A system comprising:

a plurality of thermoelectric elements;

a first plate coupled to the plurality of thermoelectric elements;

a second plate coupled to the plurality of thermoelectric elements and thermally coupled to an environment;

a first plurality of ductile fibers configured to transfer heat between the second plate and the environment, the first plurality of ductile fibers having a first end coupled to the environment and a second end coupled to the second plate;

wherein the first plurality of ductile fibers are bundled together at the second end, and the first plurality of ductile fibers at the first end are arranged such that the first plurality of ductile fibers are radiating from the second plate, and a distance between the first plurality of ductile fibers at the first end is larger than a distance between the first plurality of ductile fibers at the second end.

2. The system of claim 1 , wherein the first plurality of ductile fibers are coated with metal.

3. The system of claim 1 , wherein the first plurality of ductile fibers are coupled to the second plate using induction soldering.

4. The system of claim 1 , wherein the first plurality of ductile fibers are bundled together using a bind.

5. The system of claim 1 , wherein the first plurality of ductile fibers are coupled to the second plate using one of solder, braze, and epoxy.

6. The system of claim 1 , further comprising a second plurality of ductile fibers coupled to the second plate, the second plurality of ductile fibers configured to transfer heat between the second plate and the environment.

7. The system of claim 1 , wherein the first plate is coupled to a second environment, the system further comprising:

a second plurality of ductile fibers coupled to the first plate, the second plurality of ductile fibers configured to transfer heat between the first plate and the second environment.

8. The system of claim 1 , further comprising:

a third plate, the third plate coupled to the first plurality of ductile fibers and the second plate, the third plate arranged between the second plate and the first plurality of ductile fibers.

9. The system of claim 1 , wherein a wall comprising insulative material is situated between the first plate and the second plate, the wall situated around at least one of the plurality of thermoelectric elements.

10. A method comprising:

thermally coupling a first plate to a plurality of thermoelectric elements;

thermally coupling a second plate to the plurality of thermoelectric elements and to an environment; and

coupling a first plurality of ductile fibers to the second plate, the first plurality of ductile fibers configured to transfer heat between the second plate and the environment,

the first plurality of ductile fibers having a first end coupled to the environment and a second end coupled to the second plate;

wherein the first plurality of ductile fibers are bundled together at the second end, and the first plurality of ductile fibers at the first end are arranged such that the first plurality of ductile fibers are radiating from the second plate, and a distance between the first plurality of ductile fibers at the first end is larger than a distance between the first plurality of ductile fibers at the second end.

11. The method of claim 10 , wherein the first plurality of ductile fibers are coated with metal.

12. The method of claim 10 , wherein the first plurality of ductile fibers are coupled to the second plate using induction soldering.

13. The method of claim 10 , wherein the first plurality of ductile fibers are bundled together using a bind.

14. The method of claim 10 , wherein the first plurality of ductile fibers are coupled to the second plate using one of solder, braze, and epoxy.

15. The method of claim 10 , further comprising coupling a second plurality of ductile fibers to the second plate, the second plurality of ductile fibers configured to transfer heat between the second plate and the environment.

16. The method of claim 10 , wherein the first plate is coupled to a second environment, the method further comprising:

coupling a second plurality of ductile fibers to the first plate, the second plurality of ductile fibers configured to transfer heat between the first plate and the second environment.

17. The method of claim 10 , further comprising:

coupling a third plate to the first plurality of ductile fibers and the second plate, the third plate arranged between the second plate and the first plurality of ductile fibers.

18. The method of claim 10 , further comprising coupling a wall comprising insulative material between the first plate and the second plate, the wall situated around at least one of the plurality of thermoelectric elements.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2019
From: MARLOW INDUSTRIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 048669/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2016
From: MOCZYGEMBA, JOSHUA E.
To: MARLOW INDUSTRIES, INC.
Reel/Frame 039168/0236 →
Continuity (2)
Provisional Application 62194087 · Jul 17, 2015
Related Publication 20170018698A1 · Jan 19, 2017