Sensor package
View Patent ↗A sensor package includes a pressure sensor, a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor, a lead frame through which a result of computation performed by the computation unit is output to an outside, a main housing that is formed of resin and that holds the lead frame, and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed. The pressure sensor is disposed in the main housing using the sensor housing.
1. A sensor package comprising:
a pressure sensor;
a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor;
a lead frame through which a result of computation performed by the computation unit is output to an outside;
a main housing that is formed of resin and that holds the lead frame; and
a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed,
wherein the pressure sensor is disposed in the main housing using the sensor housing.
2. The sensor package according to claim 1 , further comprising:
an integrated circuit board that includes the computation unit and that is disposed in the inner space of the sensor housing.
3. The sensor package according to claim 2 ,
wherein the integrated circuit board and the lead frame are electrically connected to each other through a connection disposed in a hole that penetrates through the sensor housing.
4. The sensor package according to claim 3 ,
wherein at least part of the sensor housing is disposed on the lead frame.
5. The sensor package according to claim 1 , further comprising:
an integrated circuit board that includes the computation unit and that is disposed at a position which is outside the sensor housing and in the main housing.
6. The sensor package according to claim 5 ,
wherein the main housing has one surface having a recess, another surface facing the one surface, and a through hole that penetrates from the other surface to the recess,
wherein the sensor housing covers a region where the through hole is connected to the recess, and the through hole and the inner space of the sensor housing communicate with each other so as to form a space closed to the recess, and
wherein the integrated circuit board is disposed at a position which is in the recess and outside the sensor housing.
7. The sensor package according to claim 6 ,
wherein the through hole and the inner space are filled with a pressure transmission medium, and the pressure sensor disposed in the inner space is covered with the pressure transmission medium, and
wherein the recess is filled with a resin having a higher Young's modulus than a Young's modulus of the pressure transmission medium, and the integrated circuit board is covered with the resin having the higher Young's modulus than a Young's modulus of the pressure transmission medium.
8. The sensor package according to claim 7 , further comprising:
a metal wire that connects the integrated circuit board and a pad provided on a lower surface of the sensor housing to each other,
wherein the integrated circuit board and the pressure sensor are electrically connected to each other through the metal wire, and the metal wire is covered with the resin having the higher Young's modulus than the Young's modulus of the pressure transmission medium.
9. The sensor package according to claim 8 ,
wherein the pressure sensor and the pad are electrically connected to each other through a connection disposed in a hole that penetrates through the sensor housing.
10. The sensor package according to claim 1 , further comprising:
a material that has a lower Young's modulus than a Young's modulus of the sensor housing and that is disposed between the main housing and the sensor housing.