Temperature sensor integrated type semiconductor pressure sensor apparatus
View Patent ↗A temperature sensor integrated type semiconductor pressure sensor apparatus includes a temperature detection device, a lead wire covered with a lead wire protection material, and a terminal, which are integrated together by a thermoplastic resin. This can prevent the lead wire from being deformed in the assembly process, thereby simplifying the assembly process. Furthermore, the temperature detection device is exposed from the opening at the tip of the protrusion, which can secure enough temperature response. Furthermore, the temperature detection device, the lead wire and the lead wire protection material are covered with the thermoplastic resin, so they are protected from combustion gas component, oil contaminant and corrosion product included in intake air.
1. A temperature sensor integrated type semiconductor pressure sensor apparatus in which a pressure sensor module and a temperature sensor module are contained in a resin enclosure,
wherein the resin enclosure includes: a pressure guiding path containing a pressure detection device of the pressure sensor module; a container provided adjacent to the pressure guiding path, containing the temperature sensor module; and a protrusion provided such that part of the container protrudes further than an inlet of the pressure guiding path,
wherein the temperature sensor module includes: a temperature detection device fixed at the tip of the protrusion; a lead wire covered with a lead wire protection material; a terminal connected to the temperature detection device via the lead wire; and a resin covering the temperature detection device, the lead wire covered with the lead wire protection material, and the terminal, and
wherein the temperature detection device, the lead wire and the terminal are integrated together by the resin, and
wherein a portion of the resin is provided between the lead wire protection material and an inner space of the container.
2. The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 1 , wherein the inner space of the container is formed to narrow toward the tip of the protrusion.
3. The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 1 , wherein the protrusion has an opening at a tip of the protrusion, and the temperature detection device is placed outside the container through the opening.
4. The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 3 , wherein the protrusion is cylindrical and has a concave portion at the outer edge of the opening that is more recessed than the remaining part, and wherein a seal member is provided to seal the gap between the resin of the temperature sensor module and the opening, and is fitted into the concave portion and fixed.
5. The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 4 , wherein the seal member covers the temperature detection device with the resin in between.
6. The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 4 , wherein the seal member is an O-ring or a packing.
7. The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 1 , wherein the resin is a thermoplastic resin.