Power semiconductor device
View Patent ↗A power semiconductor device is disclosed having a power semiconductor element with an upper and lower side, the upper side being located opposite to the lower side; a first and second electrode, and a housing, wherein the power semiconductor element is arranged between the first and second electrode such, that the upper side comprises a first contact portion being in contact with the first electrode and a first free portion not being in contact with the first electrode, and wherein the lower side at least comprises a second contact portion being in contact with the second electrode, and wherein a channel is provided fluidly connecting at least a part of the first free portion with a predetermined degassing point of the housing for guiding an overpressure, which overpressure results from plasma and/or gas occurring in a failure mode, from the first free portion to the predetermined degassing point.
1. A Power semiconductor device, comprising:
a power semiconductor element with an upper side and with a lower side, the upper side being located opposite to the lower side;
a first electrode and a second electrode, and
a housing, wherein
the power semiconductor element is arranged between the first electrode and the second electrode such that the upper side comprises a first contact portion being in contact with the first electrode and a first free portion not being in contact with the first electrode, the first free portion located at a perimeter of the upper side, and wherein the lower side at least comprises a second contact portion being in contact with the second electrode, and wherein
a channel is provided fluidly connecting at least a part of the first free portion with a predetermined degassing point of the housing for guiding an overpressure, which overpressure results from at least one of plasma and gas occurring in a failure mode during operation of the power semiconductor device, from the first free portion to the predetermined degassing point;
wherein the predetermined degassing point is realized by a defined weakened portion of the housing, which degassing point is airtightly closed in normal operation mode and gas permeable in failure mode,
wherein the first electrode comprises an extension at the perimeter, the extension located above the first free portion and spaced apart from the first free portion, and
wherein the channel is located in the extension.
2. The Power semiconductor device according to claim 1 , wherein the predetermined degassing point is provided in a flange, wherein the flange connects the first electrode with a further part of the housing.
3. The Power semiconductor device according to claim 1 , wherein an edging is provided for enclosing free portion.
4. The Power semiconductor device according to claim 1 , wherein a gas guiding device is provided in vicinity to the predetermined degassing point.
5. The Power semiconductor device according to claim 4 , wherein the gas guiding device is a polymer ring.
6. The Power semiconductor device according to claim 1 , wherein the channel is formed as a path through the first electrode.
7. The Power semiconductor device according to claim 1 , wherein a portion of the first electrode facing a free portion of the upper side is arranged in a two-part form.
8. The Power semiconductor device according to claim 1 , wherein the power semiconductor device is a thyristor.
9. The Power semiconductor device according claim 1 , wherein a portion of the electrode facing a free portion of the lower side is arranged in a two-part form.
10. The Power semiconductor device according to claim 1 , wherein the power semiconductor device is a diode.
11. The Power semiconductor device according to claim 2 , wherein an edging is provided for enclosing free portion.
12. The Power semiconductor device according to claim 2 , wherein a gas guiding device is provided in vicinity to the predetermined degassing point.
13. The Power semiconductor device according to claim 12 , wherein the gas guiding device is a polymer ring.
14. The Power semiconductor device according to claim 2 , wherein the channel is formed as a path through the electrode.
15. The Power semiconductor device according to claim 2 , wherein a portion of the first electrode facing a free portion of the upper side is arranged in a two-part form.
16. The Power semiconductor device according to claim 2 , wherein the power semiconductor device is a thyristor.
17. The Power semiconductor device according claim 2 , wherein a portion of the first electrode facing a free portion of the lower side is arranged in a two-part form.
18. The Power semiconductor device according to claim 2 , wherein the power semiconductor device is a diode.
19. The Power semiconductor device according to claim 1 ,
wherein the predetermined degassing point is provided in a flange, wherein the flange connects the first electrode with a further part of the housing;
wherein an edging is provided for enclosing free portion;
wherein a gas guiding device is provided in vicinity to the predetermined degassing point;
wherein the gas guiding device is a polymer ring; and
wherein the channel is formed as a path through the electrode.
20. The Power semiconductor device according to claim 1 ,
wherein the predetermined degassing point is provided in a flange, wherein the flange connects the first electrode with a further part of the housing;
wherein a portion of the first electrode facing a free portion of the upper side is arranged in a two-part form; and
wherein the power semiconductor device is a thyristor.