Interfacing a light emitting diode (LED) module to a heat sink
A light emitting diode (LED) module is in thermal communication with front and back heat sinks for dissipation of heat therefrom. The LED module is physically held in place with at least the back heat sink. A mounting ring and locking ring can also be used to hold the LED module in place and in thermal communication with the back heat sink. Key pins and key holes are used to prevent using a high power LED module with a back heat sink having insufficient heat dissipation capabilities required for the high power LED module. The key pins and key holes allow lower heat generating (power) LED modules to be used with higher heat dissipating heat sinks, but higher heat generating (power) LED modules cannot be used with lower heat dissipating heat sinks.
1. An apparatus for illumination, comprising:
a light emitting diode (LED) module comprising:
a substrate having at least one light emitting diode (LED); and
a first electrical connector electrically coupled to the at least one LED;
a back heat sink; and
a mounting ring attached to the back heat sink, the mounting ring comprising a second electrical connector, wherein the LED module is positioned in the mounting ring and wherein the second electrical connector is electrically connected to the first electrical connector.
2. The apparatus of claim 1 , wherein the first electrical connector extends outwardly from an outer wall of the LED module.
3. The apparatus of claim 2 , wherein the first electrical connector is positioned in a notch formed in a wall of the mounting ring.
4. The apparatus of claim 3 , wherein the outer wall of the LED module extends around the at least one LED.
5. The apparatus of claim 1 , wherein electrical wires are connected to the second electrical connector.
6. The apparatus of claim 5 , further comprising a locking ring that secures the LED module within the mounting ring and wherein the electrical wires extend between the locking ring and the back heat sink.
7. The apparatus of claim 6 , wherein the locking ring includes an opening and wherein the electrical wires extend through the opening.
8. The apparatus of claim 5 , wherein electrical power is provided to the at least one LED from the electrical wires through the second electrical connector and the first electrical connector.
9. The apparatus of claim 1 , wherein the first electrical connector is electrically coupled to the at least one LED by electrical connections of the substrate.
10. The apparatus of claim 1 , wherein a front surface of the back heat sink is in thermal communication with a back surface of the LED module.
11. An apparatus for illumination, comprising:
a light emitting diode (LED) module comprising:
a substrate having at least one light emitting diode (LED); and
a first electrical connector electrically coupled to the at least one LED;
a mounting ring comprising a second electrical connector, wherein the LED module is positioned in the mounting ring; and
a locking ring, wherein the locking ring secures the LED module within the mounting ring and wherein the second electrical connector is electrically connected to the first electrical connector.
12. The apparatus of claim 11 , wherein the first electrical connector extends outwardly from an outer wall of the LED module.
13. The apparatus of claim 12 , wherein the first electrical connector is positioned in a notch formed in a wall of the mounting ring.
14. The apparatus of claim 13 , wherein the outer wall of the LED module extends around the at least one LED.
15. The apparatus of claim 11 , wherein electrical wires are connected to the second electrical connector.
16. The apparatus of claim 15 , wherein the electrical wires extend between the locking ring and the back heat sink and wherein electrical power is provided to the at least one LED from the electrical wires through the second electrical connector and the first electrical connector.
17. The apparatus of claim 16 , wherein the locking ring includes an opening and wherein the electrical wires extend through the opening.
18. The apparatus of claim 11 , wherein the first electrical connector is electrically coupled to the at least one LED by electrical connections of the substrate.
19. The apparatus of claim 11 , further comprising a back heat sink attached to the mounting ring.
20. The apparatus of claim 19 , wherein a front surface of the back heat sink is in thermal communication with a back surface of the LED module.