Display panel and electronic device

1. A display panel, comprising:

a base substrate including a display region and a border region surrounding the display region, wherein the border region includes an encapsulation region;

a plurality of display units disposed in the display region;

an encapsulation member disposed in the border region;

a plurality of wires disposed in the border region;

a peripheral metal layer disposed in the encapsulation region; and

a cover substrate arranged opposite to the base substrate,

wherein the display units and the wires are disposed between the base substrate and the cover substrate,

the encapsulation member is disposed in the encapsulation region and configured to bond and fix the base substrate to the cover substrate,

the wires at least include a plurality of first type wires and a plurality of second type wires, wherein the plurality of second type wires are disposed fully inside the encapsulation region under the encapsulation member,

the encapsulation member is in direct contact with both the peripheral metal layer and the plurality of second type wires disposed, and

both the peripheral metal layer and the plurality of second type wires disposed fully inside the encapsulation region under the encapsulation member form a frit metal in the encapsulation region.

2. The display panel according to claim 1 , wherein:

the plurality of second type wires disposed fully inside the encapsulation region under the encapsulation member are disposed between the cover substrate and the peripheral metal layer; and

the plurality of second type wires disposed fully inside the encapsulation region under the encapsulation member are electrically insulated from the peripheral metal layer.

3. The display panel according to claim 1 , wherein:

the wires and the peripheral metal layer are formed by a same conductive layer.

4. The display panel according to claim 1 , wherein:

the display unit is an organic light-emitting diode (OLED) display unit or a liquid crystal display (LCD) unit.

5. The display panel according to claim 1 , wherein:

the border region further includes a wiring region surrounding the display region;

the encapsulation region surrounds the wiring region; and

the plurality of first type wires are disposed in the wiring region.

6. The display panel according to claim 5 , wherein:

the wiring region has a first surface disposed with the plurality of first type wires,

the encapsulation region has a second surface disposed with the plurality of second type wires, and

the first surface after being disposed with the plurality of first type wires exhibits a value of surface roughness different from the second surface after being disposed with the plurality of second type wires.

7. The display panel according to claim 5 , wherein:

each second type wire includes a plurality of hollow patterns configured to increase the adhesive force between the base substrate and the encapsulation member.

8. The display panel according to claim 1 , wherein:

each second type wire has a width of approximately 5 μm-10 μm, including 5 μm and 10 μm.

9. The display panel according to claim 1 , wherein:

the second type wire has a width larger than the first type wire.

10. The display panel according to claim 1 , wherein:

the wires include a plurality of scanning lines and a plurality of data lines; and

all the scanning lines and data lines are disposed in the encapsulation region.

11. The display panel according to claim 1 , wherein:

the border region further includes a wiring region surrounding the display region;

the encapsulation region surrounds the wiring region; and

the wires include a plurality of signal lines disposed in the encapsulation region and a plurality of scanning lines disposed in the wiring region.

12. The display panel according to claim 1 , wherein:

the border region further includes a wiring region surrounding the display region;

the encapsulation region surrounds the wiring region; and

the wires include a plurality of scanning lines disposed in the wiring region and a plurality of data lines disposed in the encapsulation region.

13. The display panel according to claim 1 , wherein:

the wires are made of molybdenum or alloys of molybdenum and niobium.

14. The display panel according to claim 1 , wherein:

the display panel has a rectangular shape, a circular shape, or an octagonal shape.

15. An electronic device, comprising a display panel, wherein the display panel comprising:

a base substrate including a display region and a border region surrounding the display region, wherein the border region includes an encapsulation region;

a plurality of display units disposed in the display region;

an encapsulation member disposed in the border region;

a plurality of wires disposed in the border region;

a peripheral metal layer disposed in the encapsulation region; and

a cover substrate arranged opposite to the base substrate,

wherein the display units and the wires are disposed between the base substrate and the cover substrate,

the encapsulation member is disposed in the encapsulation region and configured to bond and fix the base substrate to the cover substrate,

the wires at least include a plurality of first type wires and a plurality of second type wires, wherein the plurality of second type wires are disposed fully inside the encapsulation region under the encapsulation member,

the encapsulation member is in direct contact with both the peripheral metal layer and the plurality of second type wires, and

both the peripheral metal layer and the plurality of second type wires disposed fully inside the encapsulation region under the encapsulation member form a frit metal in the encapsulation region.

16. The electronic device according to claim 15 , wherein:

the plurality of second type wires disposed fully inside the encapsulation region under the encapsulation member are disposed between the cover substrate and the peripheral metal layer; and

the plurality of second type wires disposed fully inside the encapsulation region under the encapsulation member are electrically insulated from the peripheral metal layer.

17. The electronic device according to claim 15 , wherein:

the border region further includes a wiring region surrounding the display region;

the encapsulation region surrounds the wiring region; and

the plurality of first type wires are disposed in the wiring region.

18. The electronic device according to claim 15 , wherein:

the wires include a plurality of scanning lines and a plurality of data lines; and

all the scanning lines and data lines are disposed in the encapsulation region.

19. The display panel according to claim 1 , wherein:

the display panel has a non-rectangular shape,

wherein the display panel further includes a wiring region and a stepped area, a plurality of connecting terminals of the wires are disposed in the stepped area, and the wiring region is disposed between the encapsulation region and the display region,

wherein the encapsulation region further includes a sub-encapsulation region, the plurality of second type wires are disposed fully inside of the sub-encapsulation region of the encapsulation region, and the remained wires are disposed in the wiring region, and

wherein the wiring region is disposed surrounding the entire display region, and the sub-encapsulation region is disposed only surrounding a portion of the display region.

20. A display panel, comprising:

a base substrate including a display region and a border region surrounding the display region, wherein the border region includes an encapsulation region;

a plurality of display units disposed in the display region;

an encapsulation member disposed in the border region;

a plurality of wires disposed in the border region; and

a cover substrate arranged opposite to the base substrate,

wherein the display units and the wires are disposed between the base substrate and the cover substrate,

the encapsulation member is disposed in the encapsulation region and configured to bond and fix the base substrate to the cover substrate,

the wires at least include a plurality of first type wires and a plurality of second type wires, wherein the plurality of second type wires are disposed fully inside the encapsulation region under the encapsulation member and the plurality of second type wires include at least one data line or at least one scanning line, and

the plurality of second type wires disposed fully inside the encapsulation region under the encapsulation member form a frit metal in the encapsulation region.