Substrate processing apparatus and control method of substrate processing apparatus

1. A substrate processing apparatus comprising:

a processing unit to process a substrate; and

a manipulator for maintenance, the manipulator being placed near the processing unit,

wherein the manipulator includes:

a first arm; and

a second arm combined with the first arm,

the manipulator causes the first arm and the second arm to move independently of each other according to control of a controller;

the substrate processing apparatus further comprises a load lock chamber for maintenance that can accommodate the first arm and the second arm;

wherein the manipulator, according to control of the controller, causes at least a tip portion of the second arm to move into the processing unit for the tip portion to suck a part in the processing unit and causes the first arm and the second arm to hand the part from the second arm onto the first arm and to transfer the part with the first arm into the load lock chamber.

2. The substrate processing apparatus according to claim 1 , further comprising a transport unit placed near the processing unit, the transport unit including a transfer arm.

3. The substrate processing apparatus according to claim 1 , wherein

the manipulator performs maintenance work on a part in the processing unit according to control of a controller.

4. The substrate processing apparatus according to claim 3 , wherein

the manipulator performs multiple processes in the maintenance work.

5. The substrate processing apparatus according to claim 3 , wherein

the maintenance work includes a work of replacing the part or a work of cleaning the part.

6. The substrate processing apparatus according to claim 4 , wherein

the multiple processes include:

a first process of moving at least one portion of the manipulator into the processing unit;

a second process of holding the part by the at least one portion; and

a third process of transferring the part by the manipulator.

7. The substrate processing apparatus according to claim 4 , wherein

the multiple processes include:

a first process of moving at least one portion of the manipulator into the processing unit; and

a fourth process of cleaning the part by the at least one portion.

8. The substrate processing apparatus according to claim 1 , wherein

the second arm has a suction mechanism that can suck and hold a part in the processing unit.

9. The substrate processing apparatus according to claim 8 , wherein

the second arm further has an imaging element that can acquire an image of the part.

10. The substrate processing apparatus according to claim 1 , wherein

the second arm has a cleaning mechanism that can clean a part in the processing unit.

11. The substrate processing apparatus according to claim 1 , wherein

the manipulator, according to control of the controller, causes at least a tip portion of the second arm to move into the processing unit and causes the tip portion to clean a part in the processing unit.