Packages and methods of packaging sensors
Sensor packages and methods of assembling a sensor in a sensor package are provided. A preferred embodiment comprises: a base including a sensor coupled to the base wherein the base has at least one electrical connection location and a first mechanical mating interface in the shape of an arc; an electronics package with at least one electrical connection location; and a ring coupled between the base and the electronics package wherein the ring electrically connects the at least one electrical connection location on the base and the at least one electrical connection location on the electronics package and wherein the base has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface.
1. A sensor package comprising:
a base including a sensor coupled to the base wherein the base has a first electrical connection location and a first mechanical mating interface in the shape of an arc;
an electronics package with a second electrical connection location; and
a ring coupled between the base and the electronics package and having a recessed ledge on a top side of the rind designed to receive the electronics package, wherein the ring electrically connects the first electrical connection location to the second electrical connection location and wherein the ring has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface; and
a plurality of vias that terminate on the recessed ledge in first via termination points and wherein a first recessed pocket is formed in the recessed ledge surrounding each first via termination point.
2. The sensor package of claim 1 , wherein the first and second mechanical mating interfaces are a groove and protrusion combination.
3. The sensor package of claim 2 , wherein a depth of the groove is 10% or more greater than a height of the protrusion.
4. The sensor package of claim 3 , wherein the excess volume of the groove that is not filled by the protrusion is filled with adhesive.
5. The sensor package of claim 1 , wherein each via of the plurality of vias passes between the base and the electronics package to provide electrical communication between the base and the electronics package.
6. The sensor package of claim 5 , wherein the plurality of vias terminate on a bottom side of the ring in second via termination points and a second recessed pocket is formed around each of the second via termination points.
7. The sensor package of claim 1 , wherein each first via termination point has a reciprocal via termination point on a bottom side of the ring and wherein the ring has a second recessed pocket formed in the bottom side surrounding each reciprocal via termination point.
8. The sensor package of claim 1 , wherein the sensor is a MEMS sensor.
9. The sensor package of claim 8 , wherein the MEMS sensor is a pressure sensor that is mounted to a port that passes through the base.
10. The sensor package of claim 1 , wherein the base and the ring are both made from ceramic.
11. The sensor package of claim 1 , wherein the base is disk shape and further comprises a fixture alignment slot on an outside surface of the disk.
12. The sensor package of claim 1 , wherein a surface of the ring has a tongue and an outside edge of the electronics package has a reciprocal groove.
13. The sensor package of claim 1 , wherein the ring further comprises a third mechanical mating interface in the shape of an arc and the base further comprises a fourth mechanical mating interface in the shape of an arc that is reciprocal to the third mechanical mating interface.
14. A method of assembling a sensor in a sensor package comprising:
aligning a first side of a ring to a base using a first mechanical mating interface in the shape of an arc on the ring and a second mechanical mating interface in the shape of an arc on the base, wherein the base has a sensor coupled to the base;
aligning an electronics package with a second side opposite the first side of the ring where the ring has a ledge recessed down from the second side designed to receive the electronics package;
filling via holes in the ring with a conductive material to form a plurality of vias such that a first electrical connection location on the base is electrically connected to a second electrical connection location on the electronics package, wherein each via of the plurality of vias terminates in a via termination point on the ledge and wherein each via termination point is surrounded by a recessed pocket;
partially filling either the first or second mechanical mating interface with an adhesive;
coupling the ring between the base and the electronics package; and
curing the adhesive such that the base and ring are affixed.
15. The method of claim 14 , further comprising measuring a volume difference between the first mechanical mating interface and the second mechanical mating interface and metering an amount of adhesive used based on the volume difference.
16. The method of claim 14 , wherein the first and second mechanical mating interfaces are a groove and protrusion combination.
17. The method of claim 14 , wherein the conductive material is a conductive epoxy and the conductive epoxy is used as the adhesive.
18. The method of claim 14 , further comprising filling the recessed pockets in the ring with conductive epoxy.
19. The method of claim 14 , wherein the base is disk shaped and further comprises a fixture alignment slot on an outside surface of the disk.
20. The method of claim 14 , wherein a surface of the ring has a tongue and an outside edge of the electronics package has a reciprocal groove and the tongue is assembled into the groove.