Method of making a multi-electrode structure usable in molecular sensing devices
A molecular sensor includes a substrate defining a substrate plane, and a plurality of pairs of electrode sheets above or below the substrate at an angle to the substrate plane. The molecular sensor further includes a plurality of inner dielectric sheets between each electrode sheet in each pair of electrode sheets of the plurality of pairs, and an outer dielectric sheet between each pair of electrode sheets of the plurality of pairs.
1. A method of manufacturing a structure usable in a molecular sensor device, the method comprising:
providing a substrate defining a substrate plane with a protrusion protruding from the substrate at an angle to the substrate plane;
depositing a first electrode layer in an orientation along a side of the protrusion to form a first electrode sheet at the angle to the substrate plane;
depositing an inner dielectric layer on the first electrode layer to form an inner dielectric sheet at the angle to the substrate plane;
depositing a second electrode layer on the inner dielectric layer to form a second electrode sheet at the angle to the substrate plane, wherein the first electrode sheet and the second electrode sheet form a pair of electrode sheets spaced apart by the inner dielectric sheet between the first electrode sheet and the second electrode sheet;
depositing an outer dielectric layer on the second electrode layer to form an outer dielectric sheet at an angle to the substrate plane;
repeating the depositing of the first electrode layer, the inner dielectric layer, the second electrode layer, and the outer dielectric layer at least once to form spaced apart pairs of electrode sheets with an inner dielectric sheet between each electrode sheet in the pair of electrode sheets and an outer dielectric sheet between each pair of electrode sheets;
planarizing the pairs of electrode sheets, the inner dielectric sheets, and the outer dielectric sheets; and
removing an exposed end portion of each inner dielectric sheet.
2. The method of claim 1 , wherein each inner dielectric layer is deposited with a first thickness, and wherein each outer dielectric sheet is deposited with a second thickness at least one order of magnitude greater than the first thickness.
3. The method of claim 1 , further comprising, in preparation for the planarizing, attaching a mechanically supportive block material adjacent a stack formed by the deposited first electrode layers, inner dielectric layers, second electrode layers, and outer dielectric layers.
4. The method of claim 1 , wherein
removing an exposed end portion of each inner dielectric sheet further comprises measuring an electrical, capacitance, or optical measurement between each pair of electrode sheets to indicate when to cease removal.
5. The method of claim 1 , further comprising depositing a dielectric cover layer at an angle or perpendicular to the plurality of pairs of electrode sheets opposite the substrate to define a gap exposing a portion of the plurality of pairs of electrode sheets.
6. The method of claim 1 , further comprising roughening an exposed edge of each electrode sheet.
7. The method of claim 1 , further comprising connecting a plurality of lead conductors to the plurality of pairs of electrode sheets with each lead conductor connected to a respective electrode sheet, wherein each lead conductor diverges in width as the lead conductor extends away from an edge of the electrode sheet.
8. The method of claim 1 , further comprising depositing a gate electrode parallel to the substrate plane and perpendicular to an electrode plane defined by an electrode sheet in the plurality of pairs of electrode sheets.
9. The method of claim 1 , further comprising forming a plurality of channels, each channel arranged to introduce a fluid to exposed portions of at least two pairs of electrode sheets.