REARWARD ACOUSTIC DIFFUSION FOR ULTRASOUND-ON-A-CHIP TRANSDUCER ARRAY
A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.
1 . An apparatus, comprising:
a heat sink device having a non-planar mounting surface; and
an ultrasonic transducer substrate attached to the non-planar mounting surface of the heat sink device;
wherein the non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.
2 . The apparatus of claim 1 , wherein the ultrasonic transducer substrate comprises a portion of an ultrasound-on-chip device attached to the non-planar mounting surface of the heat sink device, the ultrasound-on-chip device further comprising the ultrasonic transducer substrate bonded to an integrated circuit substrate.
3 . The apparatus of claim 1 , wherein the non-planar mounting surface of the heat sink device comprises a pattern.
4 . The apparatus of claim 3 , wherein the pattern comprises a plurality of pyramid structures.
5 . The apparatus of claim 3 , wherein the pattern comprises a plurality of prism structures.
6 . The apparatus of claim 1 , wherein the non-planar mounting surface of the heat sink device comprises a plurality of irregular features.
7 . The apparatus of claim 6 , wherein plurality of irregular features comprises a sintered surface.
8 . The apparatus of claim 1 , further comprising an adhesive material that attaches the ultrasound-on-chip device to the non-planar mounting surface of the heat sink device.
9 . The apparatus of claim 8 , wherein the adhesive material comprises an epoxy material.
10 . The apparatus of claim 8 , wherein the adhesive material comprises a tungsten filled epoxy material.
11 . The apparatus of claim 1 , wherein the ultrasound transducer substrate is further configured to accommodate a solid state monolithic ultrasound transducer.
12 . An ultrasound probe, comprising:
a housing; and
an ultrasonic transducer assembly disposed within the housing, the ultrasonic transducer assembly further comprising a metal heat sink device having a non-planar mounting surface, and an ultrasonic transducer substrate attached to the non-planar mounting surface of the heat sink device;
wherein the non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.
13 . The ultrasound probe of claim 12 , wherein the ultrasonic transducer substrate comprises a portion of an ultrasound-on-chip device attached to the non-planar mounting surface of the heat sink device, the ultrasound-on-chip device further comprising the ultrasonic transducer substrate bonded to an integrated circuit substrate.
14 . The ultrasound probe of claim 13 , wherein the non-planar mounting surface of the heat sink device comprises a stamped pattern.
15 . The ultrasound probe of claim 14 , wherein the stamped pattern comprises a plurality of pyramid structures.
16 . The ultrasound probe of claim 14 , wherein the stamped pattern comprises a plurality of prism structures.
17 . The ultrasound probe of claim 12 , wherein the non-planar mounting surface of the heat sink device comprises a plurality of irregular features.
18 . The ultrasound probe of claim 17 , wherein the plurality of irregular features comprises a sintered surface.
19 . The ultrasound probe of claim 12 , further comprising an adhesive material that attaches the ultrasound-on-chip device to the non-planar mounting surface of the heat sink device.
20 . The ultrasound probe of claim 19 , wherein the adhesive material comprises an epoxy material.
21 . The ultrasound probe of claim 19 , wherein the adhesive material comprises a tungsten filled epoxy material.
22 . The ultrasound probe of claim 12 , wherein the housing comprises a handheld probe.
23 . The ultrasound probe of claim 12 , wherein the housing comprises a patch configured to be affixed to a patient.
24 . The ultrasound probe of claim 12 , wherein the ultrasound transducer assembly further comprises a solid state monolithic ultrasound transducer.
25 . The apparatus of claim 24 , wherein the solid state monolithic ultrasound transducer further comprises a plurality of capacitive ultrasound transducers bonded with an integrated circuit.