Radio frequency isolator
Radio frequency (RF) isolators are described, coupling circuit domains operating at different voltages. The RF isolator may include a transmitter which emits a directional signal toward a receiver. Layers of materials having different dielectric constants may be arranged to confine the emission along a path to the receiver. The emitter may be an antenna having an aperture facing the receiver.
1. A radio frequency (RF) isolator, comprising:
a dielectric layer having a dielectric constant between 12 and 500 for frequencies between 5 GHz and 200 Ghz;
first and second antennae disposed at least partially within, or within ten microns of, the dielectric layer; and
a feed circuit disposed in a first die and coupled to the first antenna via a first surface of the first die,
wherein the first antenna is configured to emit a radio frequency signal, and the dielectric layer is configured to confine and transmit the radio frequency signal, and wherein
at least a portion of the first surface does not overlap the dielectric layer in a direction perpendicular from the first surface.
2. The RF isolator of claim 1 , wherein a thickness of the dielectric layer is between 5 microns and 5 mm.
3. The RF isolator of claim 1 , wherein the first and second antennae are dipole antennae.
4. The RF isolator of claim 3 , wherein the dipole antennae are linear or curved.
5. The RF isolator of claim 3 , wherein the first antenna is a dipole antenna with a reflector, and wherein the reflector is linear, planar, or curved.
6. The RF isolator of claim 1 , wherein the first antenna comprises a feed and a horn formed by a plurality of conductive vertical vias defining an aperture of the first antenna.
7. The RF isolator of claim 1 , wherein the horn has a shaped selected from the group consisting of: piece-wise linear polygon; a parabola; or a section of an ellipse.
8. The RF isolator of claim 1 , wherein the dielectric layer is a first dielectric layer, wherein the isolator further comprises a second dielectric layer having a dielectric constant less than that of the first dielectric layer, and wherein the first antenna is disposed in the second dielectric layer.
9. The RF isolator of claim 1 , wherein the dielectric layer is a first layer, and wherein the isolator further comprises a second dielectric layer adjacent the first dielectric layer and having a dielectric constant less than 12, wherein the first antenna is in the second dielectric layer.
10. A method of operation of a micro-scale isolator, comprising:
emitting a radio frequency signal from a first microfabricated antenna operating in a first voltage domain, the radio frequency signal having a frequency between 5 GHz and 200 GHz, wherein the first microfabricated antenna is coupled to a first surface of a die having a feed circuit;
confining and transmitting the radio frequency signal through a dielectric layer having a dielectric constant between 12 and 500, wherein at least a portion of the first surface does not overlap the dielectric layer in a direction perpendicular from the first surface; and
receiving the radio frequency signal with a second microfabricated antenna operating in a second voltage domain different than the first voltage domain.
11. The method of claim 10 , wherein confining and transmitting the radio frequency signal through the dielectric layer comprises confining the radio frequency signal within a height between 5 microns and 5 mm.
12. The method of claim 10 , further comprising directing the radio frequency signal through the dielectric layer using an antenna horn.
13. The method of claim 10 , further comprising directing the radio frequency signal through the dielectric layer using a reflector of the first antenna.
14. The method of claim 10 , wherein confining and transmitting the radio frequency signal through the dielectric layer comprises diffracting the radio frequency signal with a diffraction grating.
15. The method of claim 10 , wherein confining and transmitting the radio frequency signal through the dielectric layer comprises confining the radio frequency signal between conductive plates.
16. A system, including:
a first circuit operating in a first voltage domain and disposed on a first die;
a second circuit operating in a second voltage domain less than the first voltage domain and disposed on a second die; and
a radio frequency isolator coupling the first and second circuits to each other, the radio frequency isolator comprising:
a dielectric layer having a dielectric constant between 12 and 500 for frequencies between 5 GHz and 200 Ghz;
first and second antennae disposed at least partially in, or within 10 microns of, the dielectric layer; and
a feed circuit coupled to the first antenna via a first surface of the first die, wherein:
at least a portion of the first surface does not overlap the dielectric layer in a direction perpendicular from the first surface.
17. The system of claim 16 , wherein the first and second antennae are formed on a first die flip-chip mounted to a die on which the first circuit is formed.
18. The system of claim 16 , wherein the first antenna comprises a feed and a horn formed by a plurality of conductive vertical vias defining the aperture of the first antenna.
19. The system of claim 16 , wherein the first antenna is disposed in the dielectric layer.
20. The system of claim 16 , further comprising a third die, wherein the dielectric layer is disposed on the third die, and wherein the first and second antennae are disposed in a plane parallel to the first surface.