IP Library Granted Patent US 10,243,244
Granted Patent B2
US 10,243,244 · App. 15/226,646 · Granted Mar 26, 2019

Systems and methods for bonding metal parts to the polymer packaging of a battery module

Inventors: Richard M. DeKeuster (Racine, WI); Robert J. Mack (Milwaukee, WI)
Assignee: Johnson Controls Technology Company
H01M10/6551H01M2/1077H01M2/1094H01M2/305H01M10/613H01M10/625H01M10/6554H01M2/307H01M10/6561H01M2220/20
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Quick Facts
Patent No.
US 10,243,244
App. No.
15/226,646
Granted
Mar 26, 2019
Kind
B2
Abstract

The present disclosure relates to bonding or sealing metal parts to the polymer packaging of certain battery modules. The present disclosure includes a battery module having a polymer packaging with an interior and exterior and a plurality of battery cells disposed within the interior of the polymer packaging. The battery module includes a metal part that extends from the interior to the exterior of the polymer packaging and is in thermal or electrical contact with at least a portion of the plurality of battery cells. The metal part includes a bonding surface that is secured to an overmolded portion of the polymer packaging, wherein the bonding surface has a microsurface roughness that hermetically seals the bonding surface of the metal part to the overmolded portion of the polymer packaging.

Claims (22)

1. A battery module, comprising:

a polymer packaging having an interior and exterior;

a plurality of battery cells disposed within the interior of the polymer packaging; and

a terminal assembly of the battery module that extends from the interior to the exterior of the polymer packaging and is in electrical contact with terminals of the plurality of battery cells, wherein the terminal assembly comprises a terminal post coupled to a bus bar and a bonding surface that is secured to an overmolded portion of the polymer packaging, wherein the bonding surface has a microsurface roughness that hermetically seals the bonding surface of the terminal assembly to the overmolded portion of the polymer packaging, and the microsurface roughness comprises micron-scale features, sub-micron-scale features, or a combination thereof, that facilitate the hermetic sealing of the bonding surface of the terminal assembly to the overmolded portion of the polymer packaging, and wherein the bus bar includes the microsurface roughness.

2. The battery module of claim 1 , wherein the terminal assembly comprises aluminum, nickel, or copper, or combinations thereof.

3. The battery module of claim 1 , wherein the polymer packaging consists essentially of polypropylene.

4. The battery module of claim 1 , wherein an entire surface of the terminal assembly, including the bonding surface, includes the microsurface roughness.

5. A battery module, comprising:

a polymer packaging;

a plurality of battery cells disposed within the polymer packaging; and

a pair of terminal assemblies electrically coupled to the plurality of battery cells, wherein each of the terminal assemblies comprises a respective terminal post extending through and secured to a respective bus bar, wherein the bus bar of the terminal assembly comprises a bonding surface secured to an overmolded portion of the polymer packaging, wherein the bonding surface of the terminal assembly comprises a microsurface roughness that hermetically seals the bonding surface of the terminal assembly to the overmolded portion of the polymer packaging, and wherein each respective terminal post comprises a respective threaded portion that extends from a top surface of the polymer packaging.

6. The battery module of claim 5 , wherein the battery module comprises a cold plate coupled to a bottom surface of the polymer packaging and thermally coupled to the plurality of battery cells, wherein the cold plate includes a bonding surface overmolded by a second portion of the polymer packaging, wherein the bonding surface of the cold plate comprises a microsurface roughness that enables the bonding surface of the cold plate to hermetically seal to the overmolded portion of the polymer packaging.

7. The battery module of claim 5 , wherein the overmolded portion of the polymer packaging is a separate polymer insert bonded to a remainder of the polymer packaging.

8. The battery module of claim 5 , wherein the battery module is configured to provide electrical power to an xEV.

9. The battery module of claim 5 , wherein only a portion of each respective bus bar comprises the microsurface roughness.

10. The battery module of claim 5 , wherein an entire surface of each respective bus bar comprises the microsurface roughness.

11. The battery module of claim 1 , wherein only the bus bar of the terminal assembly includes the microsurface roughness.

12. The battery module of claim 1 , wherein an entire surface of the terminal post and bus bar of the terminal assembly includes the microsurface roughness.

13. The battery module of claim 1 , wherein the overmolded portion of the polymer packaging is a separate polymer piece that is insert bonded to a remainder of the polymer packaging.

14. The battery module of claim 12 , wherein a portion of the surface of the terminal assembly is configured to lose the microsurface roughness after a duration of exposure to air.

15. The battery module of claim 1 , wherein the microsurface roughness comprises sub-micron-scale features.

16. The battery module of claim 1 , wherein the microsurface roughness comprises nano-scale features.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTIES, REMOVING US APP. NO. 16332731 PREVIOUSLY RECORDED AT REEL: 049553 FRAME: 0079. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 23, 2020
From: JOHNSON CONTROLS TECHNOLOGY COMPANY
To: CPS TECHNOLOGY HOLDINGS LLC
Reel/Frame 051689/0130 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Aug 29, 2019
From: CPS TECHNOLOGY HOLDINGS LLC
To: CITIBANK N.A., AS COLLATERAL AGENT
Reel/Frame 050229/0029 →
ABL PATENT SECURITY AGREEMENT Recorded Aug 29, 2019
From: CPS TECHNOLOGY HOLDINGS LLC
To: CITIBANK N.A., AS COLLATERAL AGENT
Reel/Frame 050229/0079 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2019
From: JOHNSON CONTROLS TECHNOLOGY COMPANY
To: CPS TECHNOLOGY HOLDINGS LLC
Reel/Frame 049553/0079 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2016
From: DEKEUSTER, RICHARD M.; MACK, ROBERT J.
To: JOHNSON CONTROLS TECHNOLOGY COMPANY
Reel/Frame 039319/0919 →
Continuity (2)
Provisional Application 62250632 · Nov 4, 2015
Related Publication 20170125862A1 · May 4, 2017